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DENSO Corp.Kia Corp.Boe Innovation Investment Co. Ltd.Bayerische Motoren Werke AGAlps Alpine Co., Ltd.Subaru Corp.Subaru Corp.Aisin AW Co., Ltd.Koito Manufacturing Co., Ltd.Great Wall Motor Co., Ltd.Japan Aviation Electronics Industry Ltd.Hitachi Automotive Systems Ltd.BlackBerry Ltd.Faurecia Clarion Electronics Co., Ltd.Alpine Electronics, Inc.Socionext, Inc.Nippon Seiki Co., Ltd.HELLA GmbH & Co. KGaAGuangzhou Automobile Group Co., Ltd.Lear Corp.Altera Corp.Waymo LLCSsangyong Motor Co., Ltd.Nippon Chemical Industrial Co., Ltd.Wanxiang Group Corp.Uber Technologies, Inc.Leopold Kostal GmbH & Co. KGMurakami Corp.Huizhou Desay SV Automotive Co., Ltd.Huizhou Desay SV Automotive Co., Ltd.
BlackBerry Ltd.Socionext, Inc.Macronix International Co., Ltd.Freescale Semiconductor, Inc.VIA Technologies, Inc.Unisys Corp.Broadcom Corp.Atmel Corp.British Gas Ltd.Shenzhen Polytechnic CollegeSilicon Laboratories, Inc.TYK Corp.Schweitzer Engineering Laboratories, Inc.Indesit Company SpANuvoton Technology Corp.Hitachi Industry & Control Solutions Ltd.Pilz GmbH & Co. KGHandan CollegeEVOC Intelligent Technology Co. Ltd.EVOC Intelligent Technology Co. Ltd.SCHUNK GmbH & Co. KGHoltek Semiconductor, Inc.SAGE Electrochromics, Inc.Shanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.Stefan cel Mare University of SuceavaBaumüller Nürnberg GmbHCrestron Electronics, Inc.PTC, Inc.ATS Corp.
Marvell Asia Pte Ltd.Analog Devices, Inc.Harman International Industries, Inc.Cirrus Logic, Inc.dSPACE GmbHTula Technology, Inc.RGB Systems, Inc.GCT Semiconductor, Inc.Zoran Corp.GenomSys SAAehr Test SystemsObjectVideo, Inc.Andrea Electronics Corp.Trex Enterprises Corp.BrainScope Co., Inc.Cruise Munich GmbHAmati Communications Corp.Amati Communications Corp.Innovationszentrum für Telekommunikationstechnik GmbH IZTDeTect, Inc.Zaram Technology, Inc.Lake Technology Ltd.Quantum Machines Ltd.LOGIC Devices, Inc.BOPS, Inc.Vubiq, Inc.Hunan Advancechip Electronics Technology Co., Ltd.MuseAmi, Inc.Wolfson Dynamic Hearing Pty Ltd.Broadband Innovations, Inc.
Hoeganaes Corp.3D Systems, Inc.Autodesk, Inc.FARO Technologies, Inc.Dassault Systèmes SAXYZprinting, Inc.Kuraray Noritake Dental, Inc.Stratasys Ltd.Nippon Carbon Co., Ltd.Esstech, Inc.DWS SrlBerco SpAMedit Corp.voxeljet AGConcept Laser GmbHMetalysis Ltd.SLM Solutions Group AGRIEGL Laser Measurement Systems GmbHEarlens Corp.CAXA Technology Co., Ltd.MarkForged, Inc.Formlabs, Inc.CMET, Inc.Shanghai Union Technology Co., Ltd.Shanghai Union Technology Co., Ltd.The ExOne Co.Dassault Systèmes SolidWorks Corp.Amann Girrbach AGZrapid Technologies Co., Ltd.Perceptron, Inc.
LG Electronics, Inc.Intel Corp.Apple, Inc.Google LLCHoneywell International, Inc.Alcatel-Lucent S ANTT DOCOMO, Inc.AUDI AGHaier Smart Home Co., Ltd.MediaTek, Inc.Aisin AW Co., Ltd.Otis Elevator Co.Azbil Corp.SK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.JD.com, Inc.Sichuan Changhong Electric Co., Ltd.Sichuan Changhong Electric Co., Ltd.Orange SADeutsche Telekom AGHangzhou Hikvision Digital Technology Co., Ltd.Miele & Cie. KGHangzhou Hikvision Digital Technology Co., Ltd.Mattel, Inc.Zhejiang Dahua Technology Co. Ltd.Unisys Corp.Tata Consultancy Services Ltd.Broadcom Corp.
International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.Orange SATata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Canon Electronics, Inc.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NAVER Corp.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBaidu USA LLCDigimarc Corp.Asahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.United Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.BioMarin Pharmaceutical, Inc.Xing, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.