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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.
Alps Alpine Co., Ltd.NGK SPARK PLUG CO., LTD.Freescale Semiconductor, Inc.Analog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Takata, Inc.Keihin Corp.Asahi Kasei Microdevices Corp.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.CTS Corp.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.InvenSense, Inc.ifm electronic GmbHGiven Imaging Ltd.Preh GmbHHoriba Stec Co. Ltd.Proteus Digital Health, Inc.Kistler Holding AGBorgWarner Ludwigsburg GmbHOVAL Corp.Nagano Keiki Co., Ltd.Interface, Inc.FlexEnable Ltd.Shenzhen Suteng Innovation Technology Co., Ltd.FIGARO Engineering, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Massachusetts Institute of TechnologySaudi Arabian Oil Co.telent Ltd.Aisan Industry Co., Ltd.ConocoPhillipsShenyang Institute of AutomationPanduit Corp.KEYENCE Corp.Tridonic GmbH & Co. KGNovelis, Inc.Sagemcom Broadband SASSagemcom Broadband SASIndesit Company SpAChandigarh UniversityRiken Keiki Co., Ltd.PRÜFTECHNIK Dieter Busch AGSuncor Energy, Inc.PRÜFTECHNIK Dieter Busch AGStefan cel Mare University of SuceavaThe MITRE Corp.Sandia National LaboratoriesSigfox SALeedarson Lighting Co. Ltd.Syncrude Canada Ltd.EnOcean GmbHFairfieldNodalShenzhen Friendcom Technology Development Co., Ltd.Lierda Science & Technology Group Co., Ltd.Shenzhen Friendcom Technology Development Co., Ltd.Lierda Science & Technology Group Co., Ltd.
Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.Xilinx, Inc.