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Ampex Corp.BGP, Inc.dormakaba Deutschland GmbHThe MathWorks, Inc.Keysight Technologies, Inc.National Instruments Corp.LinkedIn Corp.ION Geophysical Corp.Kamstrup A/SQuest Software, Inc.Advantech Co., Ltd.Schneider Electric Systems USA, Inc.Schneider Electric Systems USA, Inc.Hottinger Baldwin Messtechnik GmbHBloomberg Finance LPThe Dun & Bradstreet Corp.IEI Integration Corp.Intech, Inc.Fujian Newland Auto-ID Tech Co., Ltd.Fujian Newland Auto-ID Tech Co., Ltd.Qingdao Techen Electronic Technology Co. Ltd.Adlink Technology, Inc.Shenyang Woozoom TechnologyBeijing Yishu Technology Co. Ltd.Humanetics Innovative Solutions, Inc.Zensar Technologies Ltd.Wuda Geoinformatics Co. Ltd.AllTech Medical Systems LLCBioSonics, Inc.Semptian Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Konica Minolta, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Midea Group Co. Ltd.Mita Industrial Co., Ltd.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.LAPIS Semiconductor Co. Ltd.HELLA GmbH & Co. KGaAAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGPiaggio & C SpAB/E Aerospace, Inc.
General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.Raychem Corp.
