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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Schneider Electric USA, Inc.ROBOTIS Co., Ltd.Geotab, Inc.Beijing Guangnian Wuxian Technology Co. Ltd.Shenzhen Fengchao Technology Co. Ltd.Shenzhen Fengchao Technology Co. Ltd.Skyhook Wireless, Inc.Rakuten Kobo, Inc.RareCyte, Inc.Beijing Loit Technology Ltd.Centrica Hive Ltd.Acoustic LPBeijing Geek-Geek Technology Co., Ltd.Platfarm, Inc.Beijing Geek-Geek Technology Co., Ltd.Moj.io, Inc.Gravity Co. Ltd.Accumulate ABBeijing Ronglian Yitong Information Technology Co. Ltd.Faurecia Clarion Electronics Europe SASBeijing Ronglian Yitong Information Technology Co. Ltd.Corrent Corp.Guangzhou Dabby Internet Technology Co. Ltd.Guangzhou Dabby Internet Technology Co. Ltd.MINDBODY, Inc.Firefly BioWorks, Inc.Milestone Systems A/SArcSight LLCAWIND, Inc.Aevi International GmbH
Samsung Electronics Co., Ltd.Giesecke+Devrient GmbHRambus, Inc.Kyodo Printing Co., Ltd.W.C. Heraeus GmbHSilicon Storage Technology, Inc.Ingenico Group SATECO Electric & Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Shipley Co. LLCTAKAMISAWA CYBERNETICS CO., LTD.Shenzhen Genvict Technologies Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.CEC Huada Electronic Design Co., Ltd.Beijing Watchdata Co., Ltd.Eastcompeace Technology Co., Ltd.Guangzhou Mingsen Technologies Co., Ltd.Shanghai Hua Hong NEC Electronics Co., Ltd.VeriFone, Inc.Fingerprint Cards ABWuhan Tianyu Information Industry Co., Ltd.Wuhan Tianyu Information Industry Co., Ltd.Datang Microelectronics Technology Co. Ltd.ORGA Kartensysteme GmbHHengbao Co., Ltd.IDEX Biometrics ASANewcapec Electronics Co., Ltd.Beijing Tongfang Microelectronics Co., Ltd.KONA I Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.