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Japan Radio Co. Ltd.Miyazaki Epson Corp.CTS Corp.TriQuint Semiconductor, Inc.Transense Technologies PlcResonant, Inc.WiSoL Co., Ltd.Top Touch Electronics Co., Ltd.CETC (Deqing) Huaying Electronics Co. Ltd.CETC (Deqing) Huaying Electronics Co. Ltd.Shoulder Electronics Co., Ltd.SENSeOR SASVectron International, Inc.The University of BoltonAtonomics A/SSawtek, Inc.Sawtek, Inc.Crystalwise Technology, Inc.Tai-Saw Technology Co., Ltd.SenSanna, Inc.BEFS Co., Ltd.Schmitt Industries, Inc.Columbia Research Laboratories, Inc.Precision Acoustics Ltd.Clarisay, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Micron Technology, Inc.Toppan, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
OSRAM Opto Semiconductors GmbHFreescale Semiconductor, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHHarman International Industries, Inc.Takata, Inc.TEAC Corp.Nihon Dempa Kogyo Co., Ltd.Keihin Corp.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Yamato-Scale Co., Ltd.Key Safety Systems, Inc.CTS Corp.VACUUMSCHMELZE GmbH & Co. KGWatlow Electric Manufacturing Co.Roche Diabetes Care GmbHWatlow Electric Manufacturing Co.Draeger Safety, Inc.ifm electronic GmbHAnalogic Corp.Preh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.Kistler Holding AGExelis, Inc.Shoei Chemical, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Nippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGFerranti Ltd.Piaggio & C SpAB/E Aerospace, Inc.Piaggio & C SpA