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Samsung Electronics Co., Ltd.Fujitsu Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoNTT DOCOMO, Inc.Haier Smart Home Co., Ltd.BYD Co., Ltd.Inventec Corp.British Telecommunications PlcJVCKenwood Corp.Xiaomi Corp.Nubia Technology Co., Ltd.KDDI Corp.MagnaChip Semiconductor Ltd.Wuhan China Star Optoelectronics Technology Co., Ltd.Wuhan China Star Optoelectronics Technology Co., Ltd.Bose Corp.Hosiden Corp.Huizhou TCL Mobile Communication Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.SnapTrack, Inc.Konka Group Co., Ltd.Immersion Corp.Primax Electronics Ltd.Meizu Technology Co. Ltd.Pantech & Curitel Communications, Inc.LARGAN Precision Co., Ltd.Lemobile Information Technology Beijing Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Micron Technology, Inc.Toppan, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologyWaymo LLCSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.