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Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Giesecke+Devrient GmbHRambus, Inc.Kyodo Printing Co., Ltd.W.C. Heraeus GmbHSilicon Storage Technology, Inc.EM Microelectronic-Marin SAIngenico Group SATECO Electric & Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Shipley Co. LLCTAKAMISAWA CYBERNETICS CO., LTD.Shenzhen Genvict Technologies Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.CEC Huada Electronic Design Co., Ltd.Beijing Watchdata Co., Ltd.Eastcompeace Technology Co., Ltd.Guangzhou Mingsen Technologies Co., Ltd.Shanghai Hua Hong NEC Electronics Co., Ltd.VeriFone, Inc.Fingerprint Cards ABWuhan Tianyu Information Industry Co., Ltd.Wuhan Tianyu Information Industry Co., Ltd.Datang Microelectronics Technology Co. Ltd.ORGA Kartensysteme GmbHHengbao Co., Ltd.IDEX Biometrics ASANewcapec Electronics Co., Ltd.Beijing Tongfang Microelectronics Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Giesecke+Devrient GmbHPegatron Corp.LARGAN Precision Co., Ltd.Gionee Communication Equipment Co. Ltd.Sunny Optical Technology (Group) Co., Ltd.EM Microelectronic-Marin SAShanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.CEC Huada Electronic Design Co., Ltd.Beijing Watchdata Co., Ltd.Eastcompeace Technology Co., Ltd.Wuhan Tianyu Information Industry Co., Ltd.Wuhan Tianyu Information Industry Co., Ltd.Powermat Technologies Ltd.Datang Microelectronics Technology Co. Ltd.Hengbao Co., Ltd.KONA I Co., Ltd.Kirin Co., Ltd.Reliance Jio Infocomm Ltd.Morpho Cards GmbHShenzhen Winsemi Microelectronics Co., Ltd.Splashpower Ltd.Valid Soluciones Tecnológicas SANII Holdings, Inc.IDEMIA France SASTelenor Connexion ABLifestream Technologies, Inc.
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.SEMES Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Realtek Semiconductor Corp.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.
Bank of America Corp.Visa International Service AssociationWorldpay LLCChina Merchants Bank Co., Ltd.The Bradbury GroupSociété Générale SABottomline Technologies, Inc.Danal, Inc.China Minsheng Banking Corp., Ltd.DigiCert, Inc.Chongqing Rural Commercial Bank Co., Ltd.China Everbright Bank Co. Ltd.Polska Wytwornia Papierow Wartosciowych SAConsolidated Asset Management Services (Texas) LLCChina Zheshang Bank Co., Ltd.Computer Services, Inc.Deluxe Corp.Comviva Technologies Ltd.Japan Post Bank Co., Ltd.Shanghai Hanyin Information Technology Co., Ltd.Mitek Systems, Inc.Apriva ISS LLCDFS Services LLCFundamo (Pty) Ltd.Deutsche Brse AGEuronet Worldwide, Inc.Lexisnexis Risk Solutions Inc.MiraeING Co., Ltd.CycloMedia Technology BVMagTek, Inc.