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Samsung Electronics Co., Ltd.Giesecke+Devrient GmbHRambus, Inc.Kyodo Printing Co., Ltd.W.C. Heraeus GmbHSilicon Storage Technology, Inc.EM Microelectronic-Marin SAIngenico Group SATECO Electric & Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Shipley Co. LLCTAKAMISAWA CYBERNETICS CO., LTD.Shenzhen Genvict Technologies Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.CEC Huada Electronic Design Co., Ltd.Beijing Watchdata Co., Ltd.Eastcompeace Technology Co., Ltd.Guangzhou Mingsen Technologies Co., Ltd.Shanghai Hua Hong NEC Electronics Co., Ltd.VeriFone, Inc.Fingerprint Cards ABWuhan Tianyu Information Industry Co., Ltd.Wuhan Tianyu Information Industry Co., Ltd.Datang Microelectronics Technology Co. Ltd.ORGA Kartensysteme GmbHHengbao Co., Ltd.IDEX Biometrics ASANewcapec Electronics Co., Ltd.Beijing Tongfang Microelectronics Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.Seiko Epson Corp.Apple, Inc.Hewlett-Packard Development Co.Nikon Corp.Daewoo Electronics Co. Ltd.Renesas Electronics Corp.Yamaha Corp.Lenovo Group Ltd.Lenovo (Beijing) Co., Ltd.Inventec Corp.Advanced Micro Devices, Inc.Seagate Technology LLCWestern Digital Technologies, Inc.Konica Minolta Business Technologies, Inc.Renesas Technology Corp.Arçelik ASWistron Corp.NEC Electronics Corp.Hon Hai Precision Industry Co., Ltd.Acer, Inc.Quanta Computer, Inc.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Lite-On Technology Corp.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Mita Industrial Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.