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International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLC3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.LEGO A/SLEGO A/SCitrix Systems, Inc.VMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Sandvik AktiebolagOlivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Konica Minolta, Inc.
Harbin University of Science & TechnologyTaiyo Yuden Co., Ltd.Taiyo Holdings Co., Ltd.Mattson Technology, Inc.Institut National Polytechnique de ToulouseLunghwa University of Science & TechnologyShandong Sinocera Functional Material Co., Ltd.Shandong Sinocera Functional Material Co., Ltd.Jiaxing Glead Electronics Co., Ltd.Geomatec Co., Ltd.GenoMine, Inc.Gelest, Inc.Amur State UniversityZhejiang Jiakang Electronics Co. LtdSilecs OyInkron Ltd.Central Power Research InstituteSuzhou RF Top Electronic Communications Co., Ltd.MRA Laboratories, Inc.TPL, Inc.Hochschule Ostwestfalen-LippeUniwersytet SlaskiNational Pingtung UniversityElectronic Concepts, Inc.Sri Sivasubramaniya Nadar College of EngineeringJordan Valley Semiconductors Ltd.Cambridge Nanotherm Ltd.AMET UniversityChiang Mai UniversityRoswin Co., Ltd.
Minghsin University of Science & TechnologySemi Solutions LLC
Toppan, Inc.Toyota Industries Corp.Sumitomo Bakelite Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Shanghai Sinyang Semiconductor Materials Co., Ltd.Anhui Coreach Technology Co., Ltd.Renesas Semiconductor Package & Test Solutions Co., Ltd.Jiangyin Xinji Electronic Equipment Co., Ltd.SONOCOM Co., Ltd.Advanced Photonix, Inc.UTAC Hong Kong Ltd.
Semiconductor Components Industries LLCTokyo Seimitsu Co., Ltd.Toshiba Electronic Devices & Storage Corp.Siliconware Precision Industries Co., Ltd.STATS ChipPAC Pte Ltd.Powertech Technology, Inc.IRISO Electronics Co., Ltd.CMC Materials, Inc.Okamoto Machine Tool Works, Ltd.Chipbond Technology Corp.Shenzhen Sunlord Electronics Co., Ltd.Amkor Technology, Inc.Cavendish Kinetics, Inc.Amazing Microelectronic Corp.Nefab ABTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Testo SE & Co. KGaASuzhou TA&A Ultra Clean Technology Co., Ltd.Kyoritsu Electrical Instruments Works Ltd.Thinking Electronic Industrial Co., Ltd.ETS-Lindgren, Inc.Chilisin Electronics Corp.ABC Taiwan Electronics Corp.Carsem (M) Sdn. Bhd.Revasum, Inc.Wavenics, Inc.Coilcraft, Inc.D3 Semiconductor LLCDesco Industries, Inc.