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LORD Corp.Wolverine World Wide, Inc.CTS Corp.Cytec Industries, Inc.Jushi Group Co., Ltd.Hexcel Corp.Sinopec Shanghai Petrochemical Co., Ltd.Hexcel Composites Ltd.Jiangsu Hengshen Fibre Materials Co. Ltd.Hanwha Advanced Materials Corp.Lutsk National Technical UniversityThomas Swan & Co. LtdWeihai Guangwei Composites Co., Ltd.Weihai Guangwei Composites Co., Ltd.Taekwang Industrial Co., Ltd.China Railway Prefabricated Construction Co., Ltd.FangDa Carbon New Material Co., Ltd.Izhevsk State Technical UniversityJilin Carbon Co. Ltd.Jilin Carbon Co. Ltd.Kangde Xin Composite Material Group Co., Ltd.FangDa Carbon New Material Co., Ltd.CTS Ceramics Denmark A/SSinofibers Technology Co., Ltd.Jiangsu Tianniao High Technology Co. Ltd.Wolverine Advanced Materials LLCJilin Jiyan High-tech Fibers Co. Ltd.Jilin Tangu Carbon Fiber Co., Ltd.Kurgan State University
Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.NVIDIA Corp.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Canon Electronics, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Imagination Technologies Ltd.Peking University Founder Group Corp.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.STATS ChipPAC Pte Ltd.Fujitsu Client Computing Ltd.International Computers Ltd.Compaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.Razer (Asia-Pacific) Pte. Ltd.Sundisk Corp.Qisda (Suzhou) Co. Ltd.Powertech Technology, Inc.Qisda (Suzhou) Co. Ltd.Getac Technology (Kunshan) Co. Ltd.Texas Instruments Deutschland GmbHGetac Technology (Kunshan) Co. Ltd.Control Data Corp.
Fujitsu Ltd.Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Sea Chief Supply Co. Ltd.Makita Corp.HKC Corp. Ltd.Julius Blum & Co., Inc.Inspur Electronic Information Industry Co., Ltd.Canon Electronics, Inc.Emhart Industries, Inc.Emhart Industries, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Paul Hettich GmbH & Co. KGSugatsune Kogyo Co., Ltd.Peking University Founder Group Corp.Autoliv ASP, Inc.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.U-Shin France SASAssa Abloy Ltd.King Slide Works Co., Ltd.Fujitsu Client Computing Ltd.International Computers Ltd.Aug. Winkhaus GmbH & Co. KGCompaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.
LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research InstituteMita Industrial Co., Ltd.The Dow Chemical Co.