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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Taiwan Semiconductor Manufacturing Co., Ltd.Casio Computer Co., Ltd.Micron Technology, Inc.Showa Denko K.K.Resonac Holdings Corp.Shin-Etsu Handotai Co., Ltd.SUMCO Corp.Advanced Semiconductor Engineering, Inc.EPISTAR Corp.Soitec SATokyo Seimitsu Co., Ltd.Atotech Deutschland GmbHVarian Semiconductor Equipment Associates, Inc.Fujimi, Inc.Siltronic AGNovuton Technology Corp. JapanZhejiang Jinko Solar Co. Ltd.Hirata Corp.Cymer LLCGlobalWafers Co., Ltd.Genesis Photonics, Inc.Mattson Technology, Inc.Xintec, Inc.EGing Photovoltaic Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Fujikoshi Machinery Corp.Guilford Pharmaceuticals, Inc.Guangdong Fenghua Advanced Technology (Holding) Co., Ltd.Etron Technology, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.Micronics Japan Co., Ltd.STATS ChipPAC Pte Ltd.ChipMOS Technologies, Inc.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.HANMI Semiconductor Co., Ltd.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.HANA MICRON, Inc.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Nanya Technology Corp.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGSTATS ChipPAC Pte Ltd.Invensas Corp.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.Samsung Semiconductor, Inc.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.
International Business Machines Corp.Fujitsu Ltd.Tencent Technology (Shenzhen) Co., Ltd.Yokogawa Electric Corp.Oracle America, Inc.Hewlett Packard Enterprise Development LPSeagate Technology LLCDelphi Technology, Inc.Praxair S.T. Technology, Inc.Life Technologies Corp.Juniper Networks, Inc.Unisys Corp.Tata Consultancy Services Ltd.Inspur Electronic Information Industry Co., Ltd.Avaya, Inc.MiTAC International Corp.Siemens Medical Solutions USA, Inc.Heroku, Inc.Agfa-Gevaert NVLandmark Graphics Corp.Fiberhome Telecommunication Technologies Co., Ltd.Shima Seiki Mfg. Ltd.Shima Seiki Mfg. Ltd.NARI Technology Co., Ltd.Rambus, Inc.Canon Marketing Japan, Inc.HRL Laboratories LLCBull SANEC Soft Ltd.Peking University Founder Group Corp.
Fraunhofer-Gesellschaft eVToyota Central R&D Labs, Inc.Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Dowa Electronics Materials Co., Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGPower Integrations, Inc.International Rectifier Corp.STATS ChipPAC Pte Ltd.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.eMemory Technology, Inc.Hitachi AIC, Inc.SANYO Semiconductor Co., Ltd.Xintec, Inc.Etron Technology, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Shenzhen Sunlord Electronics Co., Ltd.Amkor Technology, Inc.Princo Corp.NEPES Corp.HANA MICRON, Inc.Xiamen San'an Integrated Circuit Co., Ltd.Camtek Ltd.