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Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of Technology
Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.NVIDIA Corp.ASUSTek Computer, Inc.VIA Technologies, Inc.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Canon Electronics, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Peking University Founder Group Corp.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.STATS ChipPAC Pte Ltd.Fujitsu Client Computing Ltd.Compaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.Razer (Asia-Pacific) Pte. Ltd.Razer (Asia-Pacific) Pte. Ltd.Sundisk Corp.Qisda (Suzhou) Co. Ltd.Powertech Technology, Inc.Qisda (Suzhou) Co. Ltd.Getac Technology (Kunshan) Co. Ltd.Texas Instruments Deutschland GmbHGetac Technology (Kunshan) Co. Ltd.
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Realtek Semiconductor Corp.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.SMK Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
LG Electronics, Inc.Fujitsu Ltd.Apple, Inc.Hewlett-Packard Development Co.Taiwan Semiconductor Manufacturing Co., Ltd.Lenovo Group Ltd.Lenovo (Beijing) Co., Ltd.Motorola Solutions Credit Co. LLCHKC Corp. Ltd.Harman International Industries, Inc.Altera Corp.Nihon Dempa Kogyo Co., Ltd.Digital Equipment Corp.Rambus, Inc.Pegatron Corp.Peking University Founder Group Corp.InfoVision Optoelectronics (Kunshan) Co., Ltd.InfoVision Optoelectronics (Kunshan) Co., Ltd.Peking University Founder Group Corp.Elpida Memory, Inc.LSI Corp.Elecom Co., Ltd.Uchida Yoko Co., Ltd.NHN Corp.NEC Personal Computers Ltd.ELAN Microelectronics Corp.Silicon Integrated Systems Corp.THINKWARE Systems Corp.AvanStrate, Inc.pSemi Corp.
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Shin-Etsu Polymer Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.Silicon Laboratories, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Faraday Technology Corp.Fujian Longking Co., Ltd.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.Tongwei Co., Ltd.
Advanced Micro Devices, Inc.Toshiba Electronic Devices & Storage Corp.Pegatron Corp.STATS ChipPAC Pte Ltd.Beijing Jingwei Hirain Technologies Co., Ltd.Beijing Jingwei Hirain Technologies Co., Ltd.Powertech Technology, Inc.Silicon Integrated Systems Corp.Allwinner Technology Co., Ltd.Thermaltake Technology Co. Ltd.Graphcore Ltd.SmartGen (Zhengzhou) Technology Co., Ltd.Smiths Detection LLCIngenic Semiconductor Co., Ltd.OthersAutoChips, Inc.Beijing Horizon Robotics Technology Development Co., Ltd.Beijing Deepcool Industries Co. Ltd.Verisilicon Microelectronics (Shanghai) Co., Ltd.Minda Corp.Verisilicon Microelectronics (Shanghai) Co., Ltd.Beijing Horizon Robotics Technology Development Co., Ltd.Mercury Systems, Inc.NZXT, Inc.Spin Transfer Technologies LLCMythic, Inc.DEIF A/SInuitive Ltd.Tenstorrent, Inc.Amlogic, Inc.
