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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Lightmatter, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.MEMSIC, Inc.Sofics BVBASilicon Optronics, Inc.New Imaging Technologies SAXiroku, Inc.DecaWave Ltd.Luxtera, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Canon, Inc.Canon, Inc.Sony Group Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Eastman Kodak Co.Nikon Corp.Casio Computer Co., Ltd.Samsung Electro-Mechanics Co., Ltd.JVCKenwood Corp.Great Wall Motor Co., Ltd.Faurecia Clarion Electronics Co., Ltd.Xiaomi Corp.Hangzhou Hikvision Digital Technology Co., Ltd.Hangzhou Hikvision Digital Technology Co., Ltd.Bose Corp.Zhejiang Dahua Technology Co. Ltd.Lite-On Technology Corp.Konka Group Co., Ltd.Primax Electronics Ltd.LARGAN Precision Co., Ltd.Leica Camera AGZhejiang Uniview Technologies Co. Ltd.Zhejiang Uniview Technologies Co. Ltd.Murakami Corp.Sunny Optical Technology (Group) Co., Ltd.IEE International Electronics & Engineering SASAIC Volkswagen Automobile Co., Ltd.Ricoh Imaging Co., Ltd.Tamron Co., Ltd.
Kyocera Corp.MagnaChip Semiconductor Ltd.International Rectifier Corp.KEC Corp.Excelliance MOS Corp.Silicon Optronics, Inc.Capteur Sensors & Analysers Ltd.Advanced Power Electronics Corp.Axiom Microdevices, Inc.Suzhou Tongguan Microelectronics Co., Ltd.ClairPixel Co., Ltd.Sensovation AGImagerlabs, Inc.WiLinx Corp.AIRY3D, Inc.Silicon Semiconductor Corp.Cambrius, Inc.LeFram Technology Corp.Maxtek Technology Co. Ltd.
Sharp Corp.Oki Electric Industry Co., Ltd.Canon Marketing Japan, Inc.Silicon Optronics, Inc.Toshiba America Business Solutions, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCMagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.PixArt Imaging, Inc.LARGAN Precision Co., Ltd.Novuton Technology Corp. JapanSTMicroelectronics International NVIEE International Electronics & Engineering SABYD Semiconductor Co., Ltd.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.FUJIFILM Electronic Materials USA, Inc.OFILM Group Co., Ltd.VisEra Technologies Co., Ltd.FlexEnable Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.PMD Technologies Ltd.SEKONIX Co., Ltd.Artilux, Inc.