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Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Shin-Etsu Polymer Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.CSG Holding Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.Tongwei Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Nokia Siemens Networks Oy
Uniquify, Inc.Incentia Design Systems, Inc.
Shinano Kenshi Co., Ltd.Shinano Kenshi Co., Ltd.Videojet Technologies Ltd.Kawasaki Microelectronics, Inc.Faraday Technology Corp.Foxlink Image Technology Co., Ltd.TOVIS Co., Ltd.Measurement Specialties, Inc.Prolific Technology, Inc.ABOV Semiconductor Co., Ltd.Hyperstone GmbHZetex PlcSensoNor ASALightwave Logic, Inc.Standing Egg, Inc.Antares Advanced Test Technologies (Suzhou) Co., Ltd.Silicon Inside Co., Ltd.California Micro Devices Corp.MC Technology Co., Ltd.Color Chip (Israel) Ltd.Biorem, Inc.NEC Electronics America, Inc.Global Tronics, Inc.AerNos, Inc.EstiNet Technologies, Inc.BIOCAM GmbHPromate Electronic Co., Ltd.Custom One Design, Inc.Smiths Interconnect, Inc.Elixent Ltd.
Huawei Technologies Co., Ltd.Oki Electric Industry Co., Ltd.Hangzhou H3C Technologies Co., Ltd.Sagemcom Broadband SASSagemcom Broadband SASRazer (Asia-Pacific) Pte. Ltd.igus GmbHFujian Star-Net Communication Co., Ltd.Maipu Communication Technology Co., Ltd.Maipu Communication Technology Co., Ltd.General Cable Technologies Corp.TP-LINK Technologies Co., Ltd.ALAXALA Networks Corp.Access Co., Ltd.Arista Networks, Inc.ADTRAN, Inc.ACCO Brands Corp.Tomra Systems ASATomra Systems ASAShenzhen Han's CNC Technology Co., Ltd.Allied Telesis Holdings K.K.Shenzhen Han's CNC Technology Co., Ltd.Kunshan Q Technology Co., Ltd.Energous Corp.NETGEAR, Inc.Raisecom Technology Co., Ltd.Fibocom Wireless, Inc.Alpha Networks, Inc.Enterasys Networks, Inc.MOXA Technologies Co. Ltd.