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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Kyocera Corp.International Rectifier Corp.KEC Corp.Excelliance MOS Corp.Silicon Optronics, Inc.Capteur Sensors & Analysers Ltd.Advanced Power Electronics Corp.AltaSens, Inc.Axiom Microdevices, Inc.Suzhou Tongguan Microelectronics Co., Ltd.ClairPixel Co., Ltd.Sensovation AGImagerlabs, Inc.WiLinx Corp.AIRY3D, Inc.Cambrius, Inc.LeFram Technology Corp.Maxtek Technology Co. Ltd.
Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Cabot Corp.Air Water, Inc.Heilongjiang University of Science & TechnologyKyowa Chemical Industry Co. Ltd.Tayca Corp.Akechi Ceramics KKFujian Changting Golden Dragon Rare-Earth Co., Ltd.Tateho Chemical Industries Co., Ltd.Treibacher Industrie AGJapan Nuclear Cycle Development InstituteDoxa ABTANIOBIS GmbHOxiteno SA Industria e ComercioToho Zinc Co., Ltd.Chongyi Zhangyuan Tungsten Co., Ltd.Chongyi Zhangyuan Tungsten Co., Ltd.Sinosteel New Materials Co., Ltd.Inpria Corp.Jiangsu Xiuqiang Glasswork Co., Ltd.Orbite Technologies, Inc.Changs Ascending Enterprise Co., Ltd.Changs Ascending Enterprise Co., Ltd.Shinkosha Co., Ltd.Yunnan Wenshan Aluminum Co., Ltd.BGT Materials Ltd.Nanotecture Ltd.Thinking Electronic Industrial Co., Ltd.DM Tech Co. Ltd.École Nationale Supérieure de Chimie de ParisIbis Technology Corp.
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Shin-Etsu Polymer Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.CSG Holding Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.Tongwei Co., Ltd.
Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.Xilinx, Inc.Broadcom Corp.
NIPPON STEEL Stainless Steel Corp.Kobe Steel, Ltd.IG Farbenindustrie AGJFE Holdings, Inc.American Can Co.Suzuki Co., Ltd.American Can Co.Sumitomo Metal Industries Ltd.Hitachi Metals, Ltd.Proterial Ltd.Hitachi Construction Machinery Co., Ltd.Hitachi Cable Ltd.YKK Corp.YKK Corp.Nissan Chemical Corp.JX Nippon Mining & Metals Corp.Daido Steel Co., Ltd.Johnson Matthey PlcMitsui Mining & Smelting Co., Ltd.Toyo Seikan Group Holdings Ltd.Baoshan Iron & Steel Co., Ltd.Konami Digital Entertainment Co., Ltd.Baoshan Iron & Steel Co., Ltd.Maxell Ltd.NIPPON STEEL Stainless Steel Corp.Nippon Light Metal Co., Ltd.Sintokogio Ltd.Nippon Micrometal Corp.Kennametal, Inc.Shinko Electric Industries Co., Ltd.