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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Intel Corp.Seagate Technology LLCHGST, Inc.Universal Display Corp.KIOXIA Corp.Fujitsu Component Ltd.LSI Corp.Methode Electronics, Inc.ADATA Technology Co., Ltd.Bridgelux, Inc.Raytheon Canada Ltd.Benewake (Beijing) Co. Ltd.Benewake (Beijing) Co. Ltd.Beijing WeLion New Energy Technology Co. Ltd.Xiamen Hongfa Electroacoustic Co., Ltd.Tesat Spacecom GmbH & Co. KGBeijing WeLion New Energy Technology Co. Ltd.Inno Laser Technology Co., Ltd.Thermatool Corp.Luminus Devices, Inc.Viking Technology, Inc.Solid State System Co., Ltd.Cooledge Lighting, Inc.TeraDiode, Inc.Ledlink Optics, Inc.Futurepath Technology (Shenzhen) Co., Ltd.Ingrasys Technology, Inc.Cambridge Touch Technologies Ltd.Custom Sensors & Technologies, Inc.LeddarTech, Inc.
Sitronix Technology Corp.CEC Huada Electronic Design Co., Ltd.Hunan Goke Microelectronics Co., Ltd.IPGoal Microelectronics (Sichuan) Co., Ltd.Empyrean Technology Co., Ltd.C-Sky Microsystems Co. Ltd.Chipintelli Co. Ltd.United Memories, Inc.Innofidei, Inc.Chengdu Sino-Microelectronics Technology Co., Ltd.Shaanxi Reactor Microelectronics Co., Ltd.Asmedia Technology Inc.Beijing YanDong Microelectronic Co., Ltd.Shenzhen Chipsbank Technologies Co., Ltd.ACARD Technology Corp.Chongqing Southwest Integrated Circuit Design Co., Ltd.Advanced Power Electronics Corp.Shenzhen Legendary Technology Co., Ltd.Guangzhou Qianjun Network Technology Co., Ltd.AudioLogic, Inc.Materials Analysis Technology, Inc.Nanjing Tianyi Hexin Electronics Co. Ltd.Metanoia Communication, Inc.Nanjing Tianyi Hexin Electronics Co. Ltd.CLOVER HITECH Co., Ltd.iReady Corp.VXIS Technology Corp.Silicon Craft Technology Public Co., Ltd.Pixer Technology Ltd.Silicon Resources, Inc.
Lite-On IT Corp.MStar Semiconductor, Inc.Rockchip Electronics Co., Ltd.Meiko Electronics Co., Ltd.CEC Huada Electronic Design Co., Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsHunan Goke Microelectronics Co., Ltd.IPGoal Microelectronics (Sichuan) Co., Ltd.Avnera Corp.C-Sky Microsystems Co. Ltd.Chipintelli Co. Ltd.Mac-Eight Co., Ltd.Telink Semiconductor (Shanghai) Co., Ltd.Asmedia Technology Inc.Telink Semiconductor (Shanghai) Co., Ltd.Beijing YanDong Microelectronic Co., Ltd.Shenzhen Chipsbank Technologies Co., Ltd.ACARD Technology Corp.Advanced Power Electronics Corp.Shenzhen Legendary Technology Co., Ltd.CDNGuangzhou Qianjun Network Technology Co., Ltd.Pivotal Commware, Inc.Advanced Wireless Semiconductor Co.Silicon Inside Co., Ltd.ISSC Technologies Corp.AudioLogic, Inc.Saralon GmbHActLight SAForza Silicon Corp.
Renesas Electronics Corp.Hosiden Corp.Elecom Co., Ltd.Phison Electronics Corp.TendyRon Corp.Duracell International, Inc.Alltop Technology Co. Ltd.ADATA Technology Co., Ltd.Holtek Semiconductor, Inc.Shenzhen Netcom Electronics Co. Ltd.Kingston Technology Far East Co. Ltd.Ritek Corp.Waltop International Corp.Standard Microsystems Corp.Genesys Logic, Inc.VIA Labs, Inc.Simula Technology, Inc.Bestechnic (Shanghai) Co., Ltd.Tai Twun Enterprise Co. Ltd.Fineart Technology Co. Ltd.Yuan High-Tech Development Co., Ltd.Yuan High-Tech Development Co., Ltd.Solid State System Co., Ltd.Teledyne LeCroy, Inc.Shanghai Fengtian Electronic Co., Ltd.Solid Year Co. Ltd.Cellink Co., Ltd.Everpro Technologies Co. Ltd.XMOS Ltd.C-Media Electronics, Inc.