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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Nokia Siemens Networks Oy
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Fujitsu Semiconductor Ltd.Xilinx, Inc.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.X-FAB Semiconductor Foundries GmbHAmkor Technology, Inc.Empyrean Technology Co., Ltd.ANSYS, Inc.Xcerra Corp.Zuken Ltd.Dolphin Intégration SAMarlow Industries, Inc.Magma Design Automation LLCComair Rotron, Inc.Pulsic Ltd.Jasper Design Automation, Inc.Jedat Inc.Baum Co., Ltd.Zipalog, Inc.Tellurex Corp.IOTA TechnologyMEP Technologies, Inc.Hammond Power Solutions, Inc.Boyd Corp. (Woburn), Inc.Breker Verification Systems, Inc.Kooltronic, Inc.Athena Design Systems, Inc.Teklatech A/SValid Logic Systems, Inc.Certess, Inc.
Mitutoyo Corp.KLA Corp.FARO Technologies, Inc.Zygo Corp.OPTiM Corp.Smiths Detection-Watford Ltd.3Shape A/S3Shape A/SLiebherr-Aerospace Lindenberg GmbHPTC, Inc.Dassault Systemes Simulia Corp.Anritsu Infivis Co., Ltd.Magnaflux Corp.Photon Dynamics, Inc.UNISON Co., Ltd.Shantou Institute of Ultrasonic Instruments Co. Ltd.K LASER Technology, Inc.Shantou Institute of Ultrasonic Instruments Co. Ltd.Nikon Metrology NVFoshan Shunde Everteam Industrial Co. Ltd.Perceptron, Inc.Magnetic Analysis Corp.Ngee Ann PolytechnicJENTEK Sensors, Inc.Institut Dr. Foerster GmbH & Co. KGPaR Systems, Inc.Team, Inc.Spectronics Corp.QSA Global, Inc.Dolphitech AS
Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Polaris Innovations Ltd.Qimonda AGPowertech Technology, Inc.Xintec, Inc.NEPES Corp.HANA MICRON, Inc.Camtek Ltd.Subtron Technology Co., Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Ultrasonic Engineering Co. Ltd.Tianshui Huatian Technology Co., Ltd.Zuken Ltd.Seoul National UniversityShanghai Meadville Science & Technology Co., Ltd.Trust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Deca Technologies, Inc.Tera Probe, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Murata Electronics North America, Inc.Integrated System Assemblies Corp.Nexsem, Inc.GE Embedded Electronics OyWest Bond, Inc.
Redox, Inc.VoltServer, Inc.Baolab Microsystems SLDistalMotion SALambda Technologies, Inc.SPARQ Systems, Inc.ChapDrive ASKibron OyDeep Labs, Inc.Intradiem, Inc.Elemica, Inc.Amplidata NVSkyx Systems Corp.Pneuron Corp.Balanced Media Technology LLCNestro Lufttechnik GmbH
