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Samsung Electronics Co., Ltd.Sony Group Corp.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCMagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.PixArt Imaging, Inc.LARGAN Precision Co., Ltd.Novuton Technology Corp. JapanSTMicroelectronics International NVIEE International Electronics & Engineering SABYD Semiconductor Co., Ltd.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.FUJIFILM Electronic Materials USA, Inc.OFILM Group Co., Ltd.VisEra Technologies Co., Ltd.FlexEnable Ltd.Corephotonics Ltd.Teledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.PMD Technologies Ltd.AGC Techno Glass Co. Ltd.Artilux, Inc.
Fraunhofer-Gesellschaft eVFujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.SNECMA SAHamamatsu Photonics KKChina University of Petroleum (East China)China University of Petroleum (East China)OSRAM Opto Semiconductors GmbHTamura Corp.HIROSE ELECTRIC CO., LTD.Lawrence Livermore National LaboratoryPolitechnika WroclawskaCiena Corp.De la Rue International Ltd.MKS Instruments, Inc.Tatsuta Electric Wire & Cable Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.iconectiv LLCHisense Broadband Multimedia Technologies Co., Ltd.Seikoh Giken Co., Ltd.Hisense Broadband Multimedia Technologies Co., Ltd.Toshiba Materials Co., Ltd.NTT Electronics Corp.Finisar Corp.Finisar Corp.MPI Corp.Lumentum Operations LLCIPG Photonics Corp.Mellanox Technologies Ltd.