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thyssenkrupp Industrial Solutions AGSMS group GmbHXcellerex, Inc.STATS ChipPAC Pte Ltd.HYUNDAI ROTEM Co.ChipMOS Technologies, Inc.MULTIVAC Sepp Haggenmüller SE & Co. KGSaipem SAChroma Ate, Inc.Mühlbauer GmbH & Co. KGHarnischfeger Corp.Ansaldo Energia SpAEd. Züblin AGBWG Bergwerk- und Walzwerk-Maschinenbau GmbHSuzhou Secote Precision Electronic Co., Ltd.Imagineering, Inc.Bluewater Energy Services BVGeico SpAClextral SASHenan Communications Planning & Design Institute Co., Ltd.Hosokawa Alpine AGHydro International Ltd.Doris Engineering SAConverteam SASLingzhi Environmental Protection Co., Ltd.Danieli Automation SpALanzhou LS Heavy Equipment Co., Ltd.Lingzhi Environmental Protection Co., Ltd.Lanzhou LS Heavy Equipment Co., Ltd.Leclanché SA
International Business Machines Corp.Dow Global Technologies LLCMicrosoft Corp.Dynamic Network Services, Inc.Hewlett Packard Enterprise Development LPBoston Scientific Scimed, Inc.Baidu Online Network Technology (Beijing) Co., Ltd.NCR Corp.Adobe, Inc.Orion Co., Ltd.VMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Avaya, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Beijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.ServiceNow, Inc.NTT DATA Corp.Baidu USA LLCMegvii (Beijing) Technology Co., Ltd.NTT Communications Corp.United Video Properties, Inc.Genesys Cloud Services, Inc.Xing, Inc.Alibaba Cloud Computing Ltd.Akamai Technologies, Inc.Guangzhou Huaduo Network Technology Co., Ltd.Ikegami Tsushinki Co., Ltd.Guangzhou Huaduo Network Technology Co., Ltd.
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLC3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SCitrix Systems, Inc.VMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Sandvik AktiebolagCA Technologies, Inc.
International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.ShinMaywa Industries, Ltd.Orange SATata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Canon Electronics, Inc.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NAVER Corp.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBGP, Inc.Baidu USA LLCDigimarc Corp.Asahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.United Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.