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International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.Orange SATata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Canon Electronics, Inc.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NAVER Corp.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBaidu USA LLCDigimarc Corp.Asahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.United Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.BioMarin Pharmaceutical, Inc.Xing, Inc.
Brother Industries, Ltd.FANUC Corp.Mitsubishi Materials Corp.Harbin University of Science & TechnologyKennametal, Inc.ISCAR Ltd.Okuma Corp.Sumitomo Electric Hardmetal Ltd.Sandvik AktiebolagHitachi Via Mechanics, Ltd.Nachi-Fujikoshi Corp.Hyundai WIA Corp.Niigata Engineering Co., Ltd.Mitsui High-tec, Inc.Rolex SATakaoka Electric Mfg. Co., Ltd.Yamazaki Mazak Corp.Marposs SpAITW Ltd.Adolf Würth GmbH & Co. KGFidia SpAKonfoong Materials International Co., Ltd.ACF Industries LLCKonfoong Materials International Co., Ltd.TECO Electric & Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Chien Hsin University of Science & TechnologyTaeguTec Ltd.Korloy, Inc.ENSHU Ltd.