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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Renesas Electronics Corp.Hosiden Corp.Elecom Co., Ltd.Phison Electronics Corp.TendyRon Corp.Duracell International, Inc.Alltop Technology Co. Ltd.ADATA Technology Co., Ltd.Holtek Semiconductor, Inc.Shenzhen Netcom Electronics Co. Ltd.Kingston Technology Far East Co. Ltd.Ritek Corp.Waltop International Corp.Standard Microsystems Corp.Genesys Logic, Inc.Scosche Industries, Inc.VIA Labs, Inc.Simula Technology, Inc.Bestechnic (Shanghai) Co., Ltd.Tai Twun Enterprise Co. Ltd.Novatel Wireless, Inc.Fineart Technology Co. Ltd.Yuan High-Tech Development Co., Ltd.Yuan High-Tech Development Co., Ltd.Solid State System Co., Ltd.Teledyne LeCroy, Inc.Shanghai Fengtian Electronic Co., Ltd.Shanghai Fengtian Electronic Co., Ltd.Solid Year Co. Ltd.Cellink Co., Ltd.
Ericsson, Inc.Datang Mobile Communications Equipment Co. Ltd.Taiyo Yuden Co., Ltd.Hyundai WIA Corp.LG-Nortel Co., Ltd.SoftBank Corp.ViaSat, Inc.Wistron NeWeb Corp.Sagemcom Broadband SASRosenberger Hochfrequenztechnik GmbH & Co. KGSagemcom Broadband SASKMW, Inc.CETC Potevio Science & Technology Co., Ltd.The MathWorks, Inc.Shanghai Zenmen Technology Co. Ltd.Askey Computer Corp.Faraday Technology Corp.Arcadyan Technology Corp.TP-LINK Technologies Co., Ltd.Parrot SAPanda Electronics Group Co., Ltd.Wuhan Research Institute of Post & Telecommunications Co. Ltd.Italtel SpAD-Link Corp.T-Mobile International AG & Co. KGShakespeare Co. LLCParallel Wireless, Inc.Rearden LLCNETGEAR, Inc.Airoha Technology Corp.
Toyota Motor Corp.Huawei Technologies Co., Ltd.Apple, Inc.NTT DOCOMO, Inc.Fujikura Ltd.BlackBerry Ltd.Motorola Solutions, Inc.KDDI Corp.China United Network Communications Ltd.Motorola Mobility LLCNintendo Co., Ltd.Motorola Solutions Credit Co. LLCOrange SAGoerTek Inc.Deutsche Telekom AGChina Telecom Corp. Ltd.Toyo Ink SC Holdings Co. Ltd.Giesecke+Devrient GmbHWalmart LabsLear Corp.Skyworks Solutions, Inc.Chunghwa Picture Tubes Ltd.Nanya Technology Corp.Shenzhen Royole Technologies Co., Ltd.LG Uplus Corp.Meizu Technology Co. Ltd.Snap, Inc.Bull SAXiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.
