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Samsung Electronics Co., Ltd.International Business Machines Corp.Huawei Technologies Co., Ltd.Intel Corp.Apple, Inc.Google LLCNTT DOCOMO, Inc.South China University of TechnologyMicrosoft Corp.Industrial Technology Research InstituteShanghai Jiao Tong UniversityZhejiang University of TechnologyHarbin Institute of TechnologyUniversity of Electronic Science & Technology of ChinaBeihang UniversityKunming University of Science & TechnologyMediaTek, Inc.Dalian University of TechnologyAdvanced Micro Devices, Inc.Wuhan UniversityTongji UniversityBeijing Institute of TechnologyMinolta Co., Ltd.Zhejiang Sci-Tech UniversitySouthwest Jiaotong UniversityFuzhou UniversityHarbin University of Science & TechnologySK Telecom Co., Ltd.Wisconsin Alumni Research FoundationHangzhou Dianzi University
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.Sony Ericsson Mobile Communications AB
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Midea Group Co. Ltd.Mita Industrial Co., Ltd.
Marvell Asia Pte Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.National Semiconductor Corp.Skyworks Solutions, Inc.Kinpo Electronics, Inc.Richtek Technology Corp.International Rectifier Corp.Schneider Electric USA, Inc.MegaChips Corp.Nuvoton Technology Corp.Infineon Technologies Americas Corp.Infineon Technologies Americas Corp.EM Microelectronic-Marin SAGlobalWafers Co., Ltd.Guodian United Power Technology Co., Ltd.pSemi Corp.O2Micro International Ltd.Chloride Group Ltd.Ricoh Electronic Devices Co. Ltd.Holtek Semiconductor, Inc.AcBel Polytech, Inc.uPI Semiconductor Corp.THine Electronics, Inc.Shanghai Hua Hong NEC Electronics Co., Ltd.Sunwoda Electronic Co., Ltd.SG Micro Corp.Xiamen San'an Integrated Circuit Co., Ltd.Guangzhou Cansemi Semiconductor Technology Co Ltd.Xiamen San'an Integrated Circuit Co., Ltd.
Electronics & Telecommunications Research InstituteASML Netherlands BVHyundai MicroElectronics Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesNovatek Microelectronics Corp.Beijing NAURA Microelectronics Equipment Co., Ltd.IBM United Kingdom Ltd.JOLED, Inc.Shanghai Huali Microelectronics Corp.Shanghai Huali Microelectronics Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Wuhan Tian Ma Microelectronics Co., Ltd.Shanghai Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.SAES Getters SpAHeraeus Precious Metals GmbH & Co. KGElectro Scientific Industries, Inc.Sanechips Technology Co., Ltd.Makino Milling Machine Co., Ltd.Mine Safety Appliances Co. LLCNuvoton Technology Corp.MPI Corp.LX Semicon Co., Ltd.Fujitsu Microelectronics, Inc.ELAN Microelectronics Corp.InvenSense, Inc.Kateeva, Inc.Raydium Semiconductor Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.