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Sharp Corp.Alps Alpine Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCRosemount, Inc.Dr. Johannes Heidenhain GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Novatek Microelectronics Corp.Keihin Corp.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.ELAN Microelectronics Corp.ifm electronic GmbHPreh GmbHCrucialtec Co., Ltd.Pepperl+Fuchs, Inc.Egis Technology, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FlexEnable Ltd.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Balluff, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.