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LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.Sony Ericsson Mobile Communications AB
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
C-Data TechnologyInalp Networks AG
DASAN Networks, Inc.
IDEC Corp.Beckhoff Automation GmbH & Co. KGTomra Systems ASATomra Systems ASAEnterasys Networks, Inc.MOXA Technologies Co. Ltd.Hirschmann Electronics GmbHHirschmann Automation & Control GmbHTTTech Computertechnik AGBeijing InHand Networks Technology Co. Ltd.Beijing InHand Networks Technology Co. Ltd.RAD Data Communications, Inc.DFI Inc.PowerDsine Ltd.Innovasic, Inc.Planet Technology Corp.Hilscher Gesellschaft für Systemautomation mbHCompex, Inc.Case Communications Ltd.Sistel SRLExcelfore Corp.Asante Technologies, Inc.Weed Instrument Co., Inc.Wood Group Mustang, Inc.TELDOR Cables & Systems Ltd.DYMEC, Inc.Dowslake Microsystems Corp.
Guodian United Power Technology Co., Ltd.Nishishiba Electric Co., Ltd.Osaki Electric Co., Ltd.Bender GmbH & Co. KGFederal Signal Corp.Ipsen, Inc.Cooper Power Systems LLCSolomon Technology Corp.SCADA International A/SAllis Electric Co., Ltd.RFL Electronics, Inc.Carina Technology, Inc.AutomattaBeckwith Electric Co., Inc.Smart Information Flow Technologies LLCFanox Electronic SL