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LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.Sony Ericsson Mobile Communications AB
Fiber Mountain, Inc.Emulex Corp.Fibrefab Ltd.CoreStreet Ltd.ORBCOMM, Inc.Padcom, Inc.Cyxtera Data Centers, Inc.Workplace Technology Center, Inc.Aryaka Networks, Inc.Owlink Technology, Inc.MobileFrame LLCClip Fort Ltd.ATTO Technology, Inc.Voxcom Pty Ltd.Distrix Networks Ltd.
LG Uplus Corp.Snap, Inc.Twitter, Inc.InfoBank Corp.Kakao Corp.RingCentral, Inc.Genew Technologies Co., Ltd.Duaxes Corp.Twilio, Inc.Xiangjiang Technology Co., Ltd.Zoom Video Communications, Inc.Henan Splendor Science & Technology Co., Ltd.Henan Splendor Science & Technology Co., Ltd.Avnera Corp.Mavenir Private Holdings I Ltd.Kodiak Networks, Inc.Angel.com, Inc.Royal Mail Group Ltd.Merit Interactive Co. Ltd.LogMeIn, Inc.WhatsApp LLCTangoMe, Inc.Phone.com, Inc.Bazz, Inc.Collision Communications, Inc.International Telecommunications Satellite OrganizationGood Technology Corp.Prolifix Ltd.Movius Corp.Wickr, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.LEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology