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Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Apple, Inc.Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.AUDI AGToshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Otis Elevator Co.telent Ltd.Azbil Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Sony Group Corp.LG Electronics, Inc.Apple, Inc.Honeywell International, Inc.Alcatel-Lucent S ANTT DOCOMO, Inc.AUDI AGHaier Smart Home Co., Ltd.Carrier Corp.MediaTek, Inc.BT Group PlcAisin AW Co., Ltd.Otis Elevator Co.Azbil Corp.SK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.JD.com, Inc.Sichuan Changhong Electric Co., Ltd.Sichuan Changhong Electric Co., Ltd.Orange SADeutsche Telekom AGHangzhou Hikvision Digital Technology Co., Ltd.Miele & Cie. KGHangzhou Hikvision Digital Technology Co., Ltd.Mattel, Inc.Zhejiang Dahua Technology Co. Ltd.Unisys Corp.Broadcom Corp.
Lite-On IT Corp.MStar Semiconductor, Inc.Meiko Electronics Co., Ltd.CEC Huada Electronic Design Co., Ltd.Koha Co. Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsHunan Goke Microelectronics Co., Ltd.IPGoal Microelectronics (Sichuan) Co., Ltd.Avnera Corp.C-Sky Microsystems Co. Ltd.Chipintelli Co. Ltd.Mac-Eight Co., Ltd.Shaanxi Reactor Microelectronics Co., Ltd.Telink Semiconductor (Shanghai) Co., Ltd.Asmedia Technology Inc.Beijing YanDong Microelectronic Co., Ltd.SiliconGo Microelectronics Co. Ltd.Shenzhen Chipsbank Technologies Co., Ltd.ACARD Technology Corp.Advanced Power Electronics Corp.Shenzhen Legendary Technology Co., Ltd.CDNGuangzhou Qianjun Network Technology Co., Ltd.Pivotal Commware, Inc.Advanced Wireless Semiconductor Co.Silicon Inside Co., Ltd.ISSC Technologies Corp.AudioLogic, Inc.Saralon GmbHActLight SA
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.DISCO Corp.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.SEMES Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.HGST, Inc.