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General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.Subaru Corp.SNECMA SAThales SABeihang UniversityDaicel Corp.Lucas Industries PlcGoodrich Corp.KYB Corp.SZ DJI Technology Co., Ltd.Japan Aviation Electronics Industry Ltd.BASF Corp.Eclipse Aviation Corp.AlliedSignal, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.Tektronix, Inc.RTX Corp.United Aircraft Corp.Messerschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHPratt & Whitney Canada Corp.Northrop Grumman Systems Corp.Airbus Defence & Space GmbHNabtesco Corp.MTU Aero Engines GmbH
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.TDK Corp.Thales GroupAlps Alpine Co., Ltd.Niterra Co., Ltd.Thales SAHamamatsu Photonics KKGoodrich Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.HELLA GmbH & Co. KGaARTX Corp.LAPIS Semiconductor Co. Ltd.DePuy Synthes Products, Inc.Microchip Technology, Inc.Nabtesco Corp.The Georgia Tech Research Corp.TDK Electronics AGParker-Hannifin Corp.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Conti Temic Microelectronic GmbHTextron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.