Search results for “Blank node” companies
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Key Players
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Innovation Intensity
With the analysis among 15 patents, we discovered top 18 key players by total patent application. ZTE Corp., NARI Technology Co., Ltd., Hewlett Packard Enterprise Development LP are dominant in this area. They take 20.00% of the total patent filing.
ZTE Corp.
Guangdong Sheng, China
Patent: 1
NARI Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 1
Hewlett Packard Enterprise Development LP
Texas, United States
Patent: 1
ZTE Microelectronics Technology
Guangdong Sheng, China
Patent: 1
City Cloud Technology (China) Co., Ltd.
Zhejiang Sheng, China
Patent: 1
Matsushita Electronics Corp.
Osaka-fu, Japan
Patent: 1
NR Electric Co., Ltd.
Jiangsu Sheng, China
Patent: 1
Hewlett-Packard Development Co.
Beijing Shi, China
Patent: 1
Valtrus Innovations Ltd
United States
Patent: 1
Pangang Group Panzhihua Steel & Vanadium Co., Ltd.
Sichuan Sheng, China
Patent: 1
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 3 patents applied in the last 5 years. We discover 3 most active companies in this area.
Zhongke Shuguang Nanjing Research Institute Co., Ltd.
Jiangsu Sheng, China
Patent: 1
City Cloud Technology (China) Co., Ltd.
Zhejiang Sheng, China
Patent: 1
Shanghai Jiao Tong University
Shanghai Shi, China
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 3 patents in last 5 years, we discover 3 new entrants.
Zhongke Shuguang Nanjing Research Institute Co., Ltd.
Jiangsu Sheng, China
Patent: 1
City Cloud Technology (China) Co., Ltd.
Zhejiang Sheng, China
Patent: 1
Shanghai Jiao Tong University
Shanghai Shi, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 3 patents, we discovered top 3 universities and scientific research institutions by total patent application.
Shanghai Jiao Tong University
Shanghai Shi, China
Patent: 1
University of Electronic Science & Technology of China
Sichuan Sheng, China
Patent: 1
Beijing Information Science & Technology University
Beijing Shi, China
Patent: 1
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