With the analysis among 579 patents, we discovered top 131 key players by total patent application. SK hynix, Inc., Micron Technology, Inc., Applied Materials, Inc. are dominant in this area. They take 26.42% of the total patent filing.
Idaho, United States
Patent: 47
California, United States
Patent: 39
Samsung Electronics Co., Ltd.
International Business Machines Corp.
New York, United States
Patent: 29
Tokyo-to, Japan
Patent: 21
Bayern, Germany
Patent: 19
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 16
United Microelectronics Corp.
Taiwan Province, China
Patent: 14
ProMOS Technologies, Inc.
Taiwan Province, China
Patent: 11
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With the analysis among related 15 patents applied in the last 5 years. We discover 9 most active companies in this area. The fast-growing Micron Technology, Inc., Hubei Sinophorus Electronic Materials Co. Ltd., Micromaterials LLC take 53.33% of patent filing during this period.
Idaho, United States
Patent: 4
Hubei Sinophorus Electronic Materials Co. Ltd.
Hubei Sheng, China
Patent: 2
Semiconductor Components Industries LLC
Arizona, United States
Patent: 2
Shanghai Jita Semiconductor Co., Ltd.
Shanghai Shi, China
Patent: 1
Jiangsu Sheng, China
Patent: 1
Celex Microsystems Technology (Beijing) Co., Ltd.
Beijing Shi, China
Patent: 1
Accelink Technologies Co., Ltd.
Hubei Sheng, China
Patent: 1
With the analysis among related 15 patents in last 5 years, we discover 6 new entrants. Hubei Sinophorus Electronic Materials Co. Ltd., Micromaterials LLC, Shanghai Jita Semiconductor Co., Ltd. are the most active new entrants in this area.
Hubei Sinophorus Electronic Materials Co. Ltd.
Hubei Sheng, China
Patent: 2
Shanghai Jita Semiconductor Co., Ltd.
Shanghai Shi, China
Patent: 1
Jiangsu Sheng, China
Patent: 1
Celex Microsystems Technology (Beijing) Co., Ltd.
Beijing Shi, China
Patent: 1
Accelink Technologies Co., Ltd.
Hubei Sheng, China
Patent: 1
With the analysis among 8 patents, we discovered top 1 universities and scientific research institutions by total patent application.
New York, United States
Patent: 1