Search results for “Bump bonding” companies
Free sign up to view the full data
Key Players
Order by:
Innovation Intensity
With the analysis among 529 patents, we discovered top 152 key players by total patent application. Matsushita Electronics Corp., Shinkawa KK, Fujitsu Ltd. are dominant in this area. They take 23.63% of the total patent filing.
Osaka-fu, Japan
Patent: 86
Japan
Patent: 20
Tokyo-to, Japan
Patent: 19
South Korea
Patent: 13
Shanghai Shi, China
Patent: 13
Tokyo-to, Japan
Patent: 12
Kyoto-fu, Japan
Patent: 12
Taiwan Province, China
Patent: 10
Tokyo-to, Japan
Patent: 9
South Korea
Patent: 9
Startups & Unicorns
Order by:
Innovation Intensity
With the analysis among 7 patents, we discovered top 3 start-ups by total patent application.
Fast-Growing
Order by:
Innovation in recent 5 years
With the analysis among related 50 patents applied in the last 5 years. We discover 34 most active companies in this area. The fast-growing IQM Finland Oy, North University of China, Taiwan Semiconductor Manufacturing Co., Ltd. take 20.00% of patent filing during this period.
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 50 patents in last 5 years, we discover 23 new entrants. IQM Finland Oy, Northrop Grumman Systems Corp., Motion Engine, Inc. are the most active new entrants in this area.
Research Institutions
Order by:
Innovation Intensity
With the analysis among 28 patents, we discovered top 7 universities and scientific research institutions by total patent application. North University of China, Tsinghua University, Xi'an Jiaotong University are dominant in this area. They take 42.86% of the total patent filing.
Shanxi Sheng, China
Patent: 4
Beijing Shi, China
Patent: 2
Shaanxi Sheng, China
Patent: 1
Shanghai Shi, China
Patent: 1
Hubei Sheng, China
Patent: 1
Zhejiang Sheng, China
Patent: 1
Heilongjiang Sheng, China
Patent: 1
Keywords Quick Entry
Popular
Physics
Chemistry
Engineering
Materials science
Computer science
Biology
Medicine
MetalElectrodeVoltageSemiconductorPolymerElectricityCoatingFiberDisplay deviceRaw materialElectric motorUltimate tensile strengthNozzleCarbonBuilding constructionAlkylService lifeElectronOxideOxygenSolventControl unitFlangeControl systemDrugLight sourcePistonDiseaseElectric powerHigh pressure
View more
Page generation time: