Search results for “Chip interleaving” companies
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Key Players
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Innovation Intensity
With the analysis among 34 patents, we discovered top 17 key players by total patent application. Infineon Technologies AG, Matsushita Electronics Corp., Motorola, Inc. are dominant in this area. They take 38.24% of the total patent filing.
Bayern, Germany
Patent: 6
Osaka-fu, Japan
Patent: 4
Illinois, United States
Patent: 3
Bayern, Germany
Patent: 2
Tokyo-to, Japan
Patent: 2
United States
Patent: 2
California, United States
Patent: 1
Taiwan Province, China
Patent: 1
Tokyo-to, Japan
Patent: 1
Illinois, United States
Patent: 1
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 3 patents applied in the last 5 years. We discover 4 most active companies in this area. The fast-growing Beijing Jiaotong University, Hunan University of Technology & Business, Yantai Chuxin Aviation Technology Co., Ltd. take 100.00% of patent filing during this period.
Beijing Shi, China
Patent: 1
Hunan University of Technology & Business
China
Patent: 1
Shandong Sheng, China
Patent: 1
Hunan Sheng, China
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 3 patents in last 5 years, we discover 4 new entrants. Beijing Jiaotong University, Hunan University of Technology & Business, Yantai Chuxin Aviation Technology Co., Ltd. are the most active new entrants in this area.
Beijing Shi, China
Patent: 1
Hunan University of Technology & Business
China
Patent: 1
Shandong Sheng, China
Patent: 1
Hunan Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 5 patents, we discovered top 5 universities and scientific research institutions by total patent application. University of Minnesota, Beijing Institute of Technology, Beijing Jiaotong University are dominant in this area. They take 80.00% of the total patent filing.
Minnesota, United States
Patent: 2
Beijing Shi, China
Patent: 1
Beijing Shi, China
Patent: 1
Shaanxi Sheng, China
Patent: 1
Hunan University of Technology & Business
China
Patent: 1
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