Search results for “Inner lead bonding” companies
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Key Players
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Innovation Intensity
With the analysis among 569 patents, we discovered top 130 key players by total patent application. TOSHIBA Corp., NEC Corp., Hitachi Ltd. are dominant in this area. They take 31.99% of the total patent filing.
Tokyo-to, Japan
Patent: 87
Tokyo-to, Japan
Patent: 70
Tokyo-to, Japan
Patent: 25
South Korea
Patent: 22
Tokyo-to, Japan
Patent: 20
Osaka-fu, Japan
Patent: 19
Kanagawa-ken, Japan
Patent: 17
Japan
Patent: 14
Tokyo-to, Japan
Patent: 12
California, United States
Patent: 12
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 15 patents applied in the last 5 years. We discover 8 most active companies in this area. The fast-growing Synaptics, Inc., Chipbond Technology Corp., Guangdong Huaguan Semiconductor Co., Ltd. take 53.33% of patent filing during this period.
California, United States
Patent: 3
Taiwan Province, China
Patent: 3
Guangdong Sheng, China
Patent: 2
Guangdong Sheng, China
Patent: 2
Guizhou Sheng, China
Patent: 1
South Korea
Patent: 1
Taiwan Province, China
Patent: 1
Guangdong Sheng, China
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 15 patents in last 5 years, we discover 4 new entrants. Synaptics, Inc., Guangdong Huaguan Semiconductor Co., Ltd., Shenzhen Shengyuan Semiconductors Co. Ltd. are the most active new entrants in this area.
California, United States
Patent: 3
Guangdong Sheng, China
Patent: 2
Guangdong Sheng, China
Patent: 2
Guangdong Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 8 patents, we discovered top 3 universities and scientific research institutions by total patent application.
Jiangsu Sheng, China
Patent: 1
China
Patent: 1
Tianjin Shi, China
Patent: 1
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