Search results for “Interfacial fracture” companies
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Key Players
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Innovation Intensity
With the analysis among 26 patents, we discovered top 18 key players by total patent application. Dexerials Corp., International Business Machines Corp., Taiwan Semiconductor Manufacturing Co., Ltd. are dominant in this area. They take 46.15% of the total patent filing.
Dexerials Corp.
Tokyo-to, Japan
Patent: 5
International Business Machines Corp.
New York, United States
Patent: 4
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 3
Hitachi Ltd.
Tokyo-to, Japan
Patent: 1
Honda Motor Co., Ltd.
Tokyo-to, Japan
Patent: 1
NIPPON STEEL CORP.
Tokyo-to, Japan
Patent: 1
DENSO Corp.
Aichi-ken, Japan
Patent: 1
Konica Minolta, Inc.
Tokyo-to, Japan
Patent: 1
Toray Industries, Inc.
Tokyo-to, Japan
Patent: 1
Baoshan Iron & Steel Co., Ltd.
Shanghai Shi, China
Patent: 1
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 27 patents applied in the last 5 years. We discover 25 most active companies in this area. The fast-growing Nanjing University of Aeronautics & Astronautics, Harbin Institute of Technology, DENSO Corp. take 22.22% of patent filing during this period.
Nanjing University of Aeronautics & Astronautics
Jiangsu Sheng, China
Patent: 3
Harbin Institute of Technology
Heilongjiang Sheng, China
Patent: 2
DENSO Corp.
Aichi-ken, Japan
Patent: 1
Shenzhen University of Technology
Guangdong Sheng, China
Patent: 1
Xi'an Jiaotong University
Shaanxi Sheng, China
Patent: 1
Xiangtan University
Hunan Sheng, China
Patent: 1
Shenzhen Advanced Electronic Materials International Innovation Research Institute
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Patent: 1
Baoshan Iron & Steel Co., Ltd.
Shanghai Shi, China
Patent: 1
University of Science & Technology Beijing
Beijing Shi, China
Patent: 1
Hunan University of Science & Technology
Hunan Sheng, China
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 27 patents in last 5 years, we discover 25 new entrants. Nanjing University of Aeronautics & Astronautics, Harbin Institute of Technology, DENSO Corp. are the most active new entrants in this area.
Nanjing University of Aeronautics & Astronautics
Jiangsu Sheng, China
Patent: 3
Harbin Institute of Technology
Heilongjiang Sheng, China
Patent: 2
DENSO Corp.
Aichi-ken, Japan
Patent: 1
Shenzhen University of Technology
Guangdong Sheng, China
Patent: 1
Xi'an Jiaotong University
Shaanxi Sheng, China
Patent: 1
Xiangtan University
Hunan Sheng, China
Patent: 1
Shenzhen Advanced Electronic Materials International Innovation Research Institute
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Patent: 1
Baoshan Iron & Steel Co., Ltd.
Shanghai Shi, China
Patent: 1
University of Science & Technology Beijing
Beijing Shi, China
Patent: 1
Hunan University of Science & Technology
Hunan Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 33 patents, we discovered top 24 universities and scientific research institutions by total patent application. The Hong Kong University of Science & Technology, Nanjing University of Aeronautics & Astronautics, Harbin Institute of Technology are dominant in this area. They take 27.27% of the total patent filing.
The Hong Kong University of Science & Technology
Hong Kong SAR, China
Patent: 4
Nanjing University of Aeronautics & Astronautics
Jiangsu Sheng, China
Patent: 3
Harbin Institute of Technology
Heilongjiang Sheng, China
Patent: 2
Arizona State University
Arizona, United States
Patent: 1
Shanghai Jiao Tong University
Shanghai Shi, China
Patent: 1
Xi'an Jiaotong University
Shaanxi Sheng, China
Patent: 1
University of Massachusetts Lowell
Massachusetts, United States
Patent: 1
Tsinghua University
Beijing Shi, China
Patent: 1
Jiangsu University
Jiangsu Sheng, China
Patent: 1
Lanzhou University
Gansu Sheng, China
Patent: 1
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