Search results for “Interfacial fracture” companies
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Key Players
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Innovation Intensity
With the analysis among 26 patents, we discovered top 18 key players by total patent application. Dexerials Corp., International Business Machines Corp., Taiwan Semiconductor Manufacturing Co., Ltd. are dominant in this area. They take 46.15% of the total patent filing.
Tokyo-to, Japan
Patent: 5
New York, United States
Patent: 4
Taiwan Province, China
Patent: 3
Tokyo-to, Japan
Patent: 1
Tokyo-to, Japan
Patent: 1
Tokyo-to, Japan
Patent: 1
Aichi-ken, Japan
Patent: 1
Tokyo-to, Japan
Patent: 1
Tokyo-to, Japan
Patent: 1
Shanghai Shi, China
Patent: 1
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 27 patents applied in the last 5 years. We discover 25 most active companies in this area. The fast-growing Nanjing University of Aeronautics & Astronautics, Harbin Institute of Technology, DENSO Corp. take 22.22% of patent filing during this period.
Jiangsu Sheng, China
Patent: 3
Heilongjiang Sheng, China
Patent: 2
Aichi-ken, Japan
Patent: 1
Guangdong Sheng, China
Patent: 1
Shaanxi Sheng, China
Patent: 1
Hunan Sheng, China
Patent: 1
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Patent: 1
Shanghai Shi, China
Patent: 1
Beijing Shi, China
Patent: 1
Hunan Sheng, China
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 27 patents in last 5 years, we discover 25 new entrants. Nanjing University of Aeronautics & Astronautics, Harbin Institute of Technology, DENSO Corp. are the most active new entrants in this area.
Jiangsu Sheng, China
Patent: 3
Heilongjiang Sheng, China
Patent: 2
Aichi-ken, Japan
Patent: 1
Guangdong Sheng, China
Patent: 1
Shaanxi Sheng, China
Patent: 1
Hunan Sheng, China
Patent: 1
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Patent: 1
Shanghai Shi, China
Patent: 1
Beijing Shi, China
Patent: 1
Hunan Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 33 patents, we discovered top 24 universities and scientific research institutions by total patent application. The Hong Kong University of Science & Technology, Nanjing University of Aeronautics & Astronautics, Harbin Institute of Technology are dominant in this area. They take 27.27% of the total patent filing.
The Hong Kong University of Science & Technology
Hong Kong SAR, China
Patent: 4
Jiangsu Sheng, China
Patent: 3
Heilongjiang Sheng, China
Patent: 2
Arizona, United States
Patent: 1
Shanghai Shi, China
Patent: 1
Shaanxi Sheng, China
Patent: 1
Massachusetts, United States
Patent: 1
Beijing Shi, China
Patent: 1
Jiangsu Sheng, China
Patent: 1
Gansu Sheng, China
Patent: 1
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