Search results for “Into-structure” companies
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Key Players
Order by:
Innovation Intensity
With the analysis among 945 patents, we discovered top 479 key players by total patent application. WoodWelding SA, SpineWelding AG, Microsoft Technology Licensing LLC are dominant in this area. They take 8.99% of the total patent filing.
WoodWelding SA
Zug, Switzerland
Patent: 41
SpineWelding AG
ZURICH, Switzerland
Patent: 28
Microsoft Technology Licensing LLC
Washington, United States
Patent: 16
International Business Machines Corp.
New York, United States
Patent: 15
W. L. Gore & Associates, Inc.
New Jersey, United States
Patent: 15
NanoGram Corp.
California, United States
Patent: 11
Monsanto Co.
Missouri, United States
Patent: 10
Honda Motor Co., Ltd.
Tokyo-to, Japan
Patent: 9
NEC Corp.
Tokyo-to, Japan
Patent: 9
Matsushita Electronics Corp.
Osaka-fu, Japan
Patent: 9
Startups & Unicorns
Order by:
Innovation Intensity
With the analysis among 8 patents, we discovered top 6 start-ups by total patent application. Legacy Foundry AG, Beijing Baidu Netcom Science & Technology Co., Ltd., NeoGraf Solutions LLC are active in this area.
STARTUP
Legacy Foundry AG
Schwyz, Switzerland
Patent: 3
Beijing Baidu Netcom Science & Technology Co., Ltd.
Beijing Shi, China
Patent: 1
STARTUP
NeoGraf Solutions LLC
Ohio, United States
Patent: 1
STARTUP
Beijing Chelian Tianxia Information Technology Co. Ltd.
Jiangsu Sheng, China
Patent: 1
STARTUP
Hannto Technology, Inc.
Shanghai Shi, China
Patent: 1
STARTUP
Soudang Com
Beijing Shi, China
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 91 patents applied in the last 5 years. We discover 73 most active companies in this area. The fast-growing Tianjin University, Legacy Foundry AG, xAD, Inc. take 8.79% of patent filing during this period.
Tianjin University
Tianjin Shi, China
Patent: 3
STARTUP
Legacy Foundry AG
Schwyz, Switzerland
Patent: 3
xAD, Inc.
New York, United States
Patent: 2
International Business Machines Corp.
New York, United States
Patent: 2
University of Akron
Pennsylvania, United States
Patent: 2
Shandong Inspur Commercial System Co. Ltd.
Shandong Sheng, China
Patent: 1
IBM United Kingdom Ltd.
Hampshire, United Kingdom
Patent: 1
Jiaao Machinery Technology (Guangdong) Co., Ltd.
Guangdong Sheng, China
Patent: 1
Chongqing University of Posts and Telecommunications
Chongqing Shi, China
Patent: 1
STARTUP
Hannto Technology, Inc.
Shanghai Shi, China
Patent: 1
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 91 patents in last 5 years, we discover 63 new entrants. Tianjin University, Legacy Foundry AG, xAD, Inc. are the most active new entrants in this area.
Tianjin University
Tianjin Shi, China
Patent: 3
STARTUP
Legacy Foundry AG
Schwyz, Switzerland
Patent: 3
xAD, Inc.
New York, United States
Patent: 2
University of Akron
Pennsylvania, United States
Patent: 2
Shandong Inspur Commercial System Co. Ltd.
Shandong Sheng, China
Patent: 1
IBM United Kingdom Ltd.
Hampshire, United Kingdom
Patent: 1
Jiaao Machinery Technology (Guangdong) Co., Ltd.
Guangdong Sheng, China
Patent: 1
Chongqing University of Posts and Telecommunications
Chongqing Shi, China
Patent: 1
STARTUP
Hannto Technology, Inc.
Shanghai Shi, China
Patent: 1
Wuhan Lingyun Building Decoration Engineering Co. Ltd.
Hubei Sheng, China
Patent: 1
Research Institutions
Order by:
Innovation Intensity
With the analysis among 102 patents, we discovered top 43 universities and scientific research institutions by total patent application. Tianjin University, University of Akron, National Taiwan University are dominant in this area. They take 7.84% of the total patent filing.
Tianjin University
Tianjin Shi, China
Patent: 3
University of Akron
Pennsylvania, United States
Patent: 2
National Taiwan University
Taiwan Province, China
Patent: 2
Nanchang University
Jiangxi Sheng, China
Patent: 2
The University of Electro-Communications
Tokyo-to, Japan
Patent: 2
President & Fellows of Harvard College
Massachusetts, United States
Patent: 2
Hangzhou Dianzi University
Zhejiang Sheng, China
Patent: 2
Massachusetts Institute of Technology
Massachusetts, United States
Patent: 1
University of Connecticut
Connecticut, United States
Patent: 1
Peking University
Beijing Shi, China
Patent: 1
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