Search results for “Metallic interconnect” companies
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Key Players
Order by:
Innovation Intensity
With the analysis among 1,186 patents, we discovered top 487 key players by total patent application. International Business Machines Corp., Taiwan Semiconductor Manufacturing Co., Ltd., Intel Corp. are dominant in this area. They take 8.26% of the total patent filing.
International Business Machines Corp.
New York, United States
Patent: 42
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 34
Intel Corp.
California, United States
Patent: 22
State Grid Corp. of China
Beijing Shi, China
Patent: 22
United Microelectronics Corp.
Taiwan Province, China
Patent: 14
Semiconductor Manufacturing International (Shanghai) Corp.
Shanghai Shi, China
Patent: 13
National Semiconductor Corp.
California, United States
Patent: 12
Samsung Electronics Co., Ltd.
South Korea
Patent: 10
Applied Materials, Inc.
California, United States
Patent: 10
Shanghai Huali Microelectronics Corp.
Shanghai Shi, China
Patent: 10
Startups & Unicorns
Order by:
Innovation Intensity
With the analysis among 21 patents, we discovered top 7 start-ups by total patent application. SJ Semiconductor (Jiangyin) Corp., Seeqc, Inc., China Automotive Battery Research Institute Co. Ltd. are active in this area.
STARTUP
SJ Semiconductor (Jiangyin) Corp.
Jiangsu Sheng, China
Patent: 10
STARTUP
Seeqc, Inc.
New York, United States
Patent: 4
STARTUP
China Automotive Battery Research Institute Co. Ltd.
Beijing Shi, China
Patent: 2
STARTUP
Yangtze Memory Technologies Co., Ltd.
Hubei Sheng, China
Patent: 2
STARTUP
Mojo Vision, Inc.
California, United States
Patent: 1
STARTUP
InSense, Inc.
California, United States
Patent: 1
STARTUP
RAJA
Sichuan Sheng, China
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 374 patents applied in the last 5 years. We discover 232 most active companies in this area. The fast-growing Taiwan Semiconductor Manufacturing Co., Ltd., International Business Machines Corp., Lam Research Corp. take 13.37% of patent filing during this period.
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 22
International Business Machines Corp.
New York, United States
Patent: 20
Lam Research Corp.
California, United States
Patent: 8
Hua Hong Semiconductor Wuxi Ltd.
Jiangsu Sheng, China
Patent: 8
Applied Materials, Inc.
California, United States
Patent: 6
STARTUP
SJ Semiconductor (Jiangyin) Corp.
Jiangsu Sheng, China
Patent: 5
Samsung Electronics Co., Ltd.
South Korea
Patent: 5
Invensas Bonding Technologies, Inc.
North Carolina, United States
Patent: 4
Shanghai Huahong Grace Semiconductor Manufacturing Corp.
Shanghai Shi, China
Patent: 4
ASM IP Holding BV
Netherlands
Patent: 4
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 374 patents in last 5 years, we discover 198 new entrants. Hua Hong Semiconductor Wuxi Ltd., Invensas Bonding Technologies, Inc., Huai'an Pachun Huaxin Plastic Products Co., Ltd. are the most active new entrants in this area.
Hua Hong Semiconductor Wuxi Ltd.
Jiangsu Sheng, China
Patent: 8
Invensas Bonding Technologies, Inc.
North Carolina, United States
Patent: 4
Huai'an Pachun Huaxin Plastic Products Co., Ltd.
Jiangsu Sheng, China
Patent: 4
Xiamen Sky Semiconductor Technology Co. Ltd.
Fujian Sheng, China
Patent: 4
Samsung SDI Co., Ltd.
Chungcheongnam-do, South Korea
Patent: 4
SOLIDpower SpA
Italy
Patent: 4
Liangqun Electronic(Changshu)Co.,Ltd.
Jiangsu Sheng, China
Patent: 3
Cummins Enterprise LLC
Indiana, United States
Patent: 3
Shenzhen Shunheying Precision Technology Development Co., Ltd.
Guangdong Sheng, China
Patent: 3
Guangdong OPPO Mobile Telecommunications Corp., Ltd.
Guangdong Sheng, China
Patent: 3
Research Institutions
Order by:
Innovation Intensity
With the analysis among 111 patents, we discovered top 53 universities and scientific research institutions by total patent application. Technical University of Denmark, University of British Columbia, University of Hong Kong are dominant in this area. They take 18.92% of the total patent filing.
Technical University of Denmark
Hovedstaden, Denmark
Patent: 8
University of British Columbia
British Columbia, Canada
Patent: 3
University of Hong Kong
Hong Kong SAR, China
Patent: 3
Tsinghua University
Beijing Shi, China
Patent: 3
North Carolina State University
North Carolina, United States
Patent: 2
Fudan University
Shanghai Shi, China
Patent: 2
Northwestern Polytechnical University
Shaanxi Sheng, China
Patent: 2
Zhengzhou University
Henan Sheng, China
Patent: 2
The Trustees of Columbia University in The City of New York
New York, United States
Patent: 1
Massachusetts Institute of Technology
Massachusetts, United States
Patent: 1
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