Search results for “Solder wetting” companies
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Key Players
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Innovation Intensity
With the analysis among 486 patents, we discovered top 160 key players by total patent application. Micron Technology, Inc., Hitachi Ltd., Matsushita Electronics Corp. are dominant in this area. They take 11.73% of the total patent filing.
Micron Technology, Inc.
Idaho, United States
Patent: 20
Hitachi Ltd.
Tokyo-to, Japan
Patent: 19
Matsushita Electronics Corp.
Osaka-fu, Japan
Patent: 18
Amkor Technology Singapore Holding Pte Ltd.
Central Singapore, Singapore
Patent: 14
Motorola Solutions, Inc.
Illinois, United States
Patent: 13
Tamura Corp.
Tokyo-to, Japan
Patent: 13
NEC Corp.
Tokyo-to, Japan
Patent: 11
DENSO Corp.
Aichi-ken, Japan
Patent: 11
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 11
International Business Machines Corp.
New York, United States
Patent: 10
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 73 patents applied in the last 5 years. We discover 38 most active companies in this area. The fast-growing Senju Metal Industry Co., Ltd., International Business Machines Corp., Matsuda Sangyo Co., Ltd. take 23.29% of patent filing during this period.
Senju Metal Industry Co., Ltd.
Tokyo-to, Japan
Patent: 8
International Business Machines Corp.
New York, United States
Patent: 5
Matsuda Sangyo Co., Ltd.
Tokyo-to, Japan
Patent: 4
Mitsubishi Electric Corp.
Tokyo-to, Japan
Patent: 3
Microsoft Technology Licensing LLC
Washington, United States
Patent: 3
Dexerials Corp.
Tokyo-to, Japan
Patent: 3
QUALCOMM, Inc.
California, United States
Patent: 3
Engent, Inc.
Georgia, United States
Patent: 3
Furukawa Electric Co., Ltd.
Tokyo-to, Japan
Patent: 3
Sekisui Chemical Co., Ltd.
Osaka-fu, Japan
Patent: 2
New Entrants
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Innovation in recent 5 years
With the analysis among related 73 patents in last 5 years, we discover 17 new entrants. Senju Metal Industry Co., Ltd., Matsuda Sangyo Co., Ltd., Dexerials Corp. are the most active new entrants in this area.
Senju Metal Industry Co., Ltd.
Tokyo-to, Japan
Patent: 8
Matsuda Sangyo Co., Ltd.
Tokyo-to, Japan
Patent: 4
Dexerials Corp.
Tokyo-to, Japan
Patent: 3
QUALCOMM, Inc.
California, United States
Patent: 3
Engent, Inc.
Georgia, United States
Patent: 3
Microsoft Technology Licensing LLC
Washington, United States
Patent: 3
Sekisui Chemical Co., Ltd.
Osaka-fu, Japan
Patent: 2
Furuya Metal Co., Ltd.
Tokyo-to, Japan
Patent: 2
Chengdu Peikes New Materials Co., Ltd.
Sichuan Sheng, China
Patent: 1
Hangzhou Youbang Soldering Material Co., Ltd.
Zhejiang Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 6 patents, we discovered top 1 universities and scientific research institutions by total patent application.
Henan Polytechnic University
Henan Sheng, China
Patent: 1
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