Search results for “Strained silicon” companies
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Key Players
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Innovation Intensity
With the analysis among 1,176 patents, we discovered top 112 key players by total patent application. International Business Machines Corp., Taiwan Semiconductor Manufacturing Co., Ltd., GLOBALFOUNDRIES, Inc. are dominant in this area. They take 29.17% of the total patent filing.
International Business Machines Corp.
New York, United States
Patent: 179
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 87
GLOBALFOUNDRIES, Inc.
New York, United States
Patent: 77
Advanced Micro Devices, Inc.
California, United States
Patent: 61
United Microelectronics Corp.
Taiwan Province, China
Patent: 49
GlobalFoundries U.S., Inc.
California, United States
Patent: 46
Intel Corp.
California, United States
Patent: 41
Soitec SA
France
Patent: 33
Semiconductor Manufacturing International (Shanghai) Corp.
Shanghai Shi, China
Patent: 30
Samsung Electronics Co., Ltd.
South Korea
Patent: 28
Startups & Unicorns
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Innovation Intensity
With the analysis among 1 patents, we discovered top 1 start-ups by total patent application.
STARTUP
SeeDevice, Inc.
California, United States
Patent: 1
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 54 patents applied in the last 5 years. We discover 27 most active companies in this area. The fast-growing Qorvo US, Inc., International Business Machines Corp., STMicroelectronics SA take 29.63% of patent filing during this period.
Qorvo US, Inc.
Oregon, United States
Patent: 6
International Business Machines Corp.
New York, United States
Patent: 5
STMicroelectronics SA
France
Patent: 5
Commissariat à l´énergie atomique et aux énergies alternatives
CENTRE COUNTY, France
Patent: 3
Institute of Microelectronics of Chinese Academy of Sciences
Beijing Shi, China
Patent: 3
Nanya Technology Corp.
Taiwan Province, China
Patent: 3
Xi'an Jiaotong University
Shaanxi Sheng, China
Patent: 2
Taiwan Semiconductor Manufacturing Co., Ltd.
Taiwan Province, China
Patent: 2
The Institute of Physics Chinese Academy of Sciences
Beijing Shi, China
Patent: 2
Micron Technology, Inc.
Idaho, United States
Patent: 2
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 54 patents in last 5 years, we discover 15 new entrants. Qorvo US, Inc., Xi'an Jiaotong University, The Institute of Physics Chinese Academy of Sciences are the most active new entrants in this area.
Qorvo US, Inc.
Oregon, United States
Patent: 6
Xi'an Jiaotong University
Shaanxi Sheng, China
Patent: 2
The Institute of Physics Chinese Academy of Sciences
Beijing Shi, China
Patent: 2
Xi'an Shiyou University
Shaanxi Sheng, China
Patent: 2
Founder Microelectronics, Inc.
Guangdong Sheng, China
Patent: 1
Shanghai Huali Integrated Circuit Manufacturing Co., Ltd.
Shanghai Shi, China
Patent: 1
Huazhong University of Science & Technology
Hubei Sheng, China
Patent: 1
Wisconsin Alumni Research Foundation
Wisconsin, United States
Patent: 1
RWTH Aachen University
Nordrhein-Westfalen, Germany
Patent: 1
Suzhou Huatai Electronic Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 119 patents, we discovered top 27 universities and scientific research institutions by total patent application. Shanghai Institute of Microsystem & Information Technology, Massachusetts Institute of Technology, University of Electronic Science & Technology of China are dominant in this area. They take 34.45% of the total patent filing.
Shanghai Institute of Microsystem & Information Technology
Shanghai Shi, China
Patent: 20
Massachusetts Institute of Technology
Massachusetts, United States
Patent: 7
University of Electronic Science & Technology of China
Sichuan Sheng, China
Patent: 6
Tsinghua University
Beijing Shi, China
Patent: 4
The University of Newcastle
New South Wales, Australia
Patent: 4
Ulsan National Institute of Science & Technology
South Korea
Patent: 4
Peking University
Beijing Shi, China
Patent: 3
Kyushu University
Fukuoka-ken, Japan
Patent: 3
National Taiwan University
Taiwan Province, China
Patent: 3
Chongqing University of Posts and Telecommunications
Chongqing Shi, China
Patent: 3
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