With the analysis among 199 patents, we discovered top 105 key players by total patent application. Furuno Electric Co., Ltd., General Electric Co., The Boeing Co. are dominant in this area. They take 18.09% of the total patent filing.
Furuno Electric Co., Ltd.
Hokkaido, Japan
Patent: 19
Massachusetts, United States
Patent: 10
Illinois, United States
Patent: 7
Halliburton Energy Services, Inc.
Texas, United States
Patent: 6
Noord-Holland, Netherlands
Patent: 5
Hampshire, United Kingdom
Patent: 5
Dow Global Technologies LLC
Michigan, United States
Patent: 5
Samsung Electronics Co., Ltd.
With the analysis among 3 patents, we discovered top 3 start-ups by total patent application.
Yawlih Technology (Beijing) Co. Ltd.
Beijing Shi, China
Patent: 1
Institut National de la Santé et de la Recherche Médicale
Shanghai Shenzhi Information Technology Co., Ltd.
Shanghai Shi, China
Patent: 1
With the analysis among related 66 patents applied in the last 5 years. We discover 43 most active companies in this area. The fast-growing Furuno Electric Co., Ltd., Obara Korea Corp., Tessonics, Inc. take 34.85% of patent filing during this period.
Furuno Electric Co., Ltd.
Illinois, United States
Patent: 6
University of British Columbia
British Columbia, Canada
Patent: 3
Nanjing Umiya Information Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 2
Samsung Electronics Co., Ltd.
Halliburton Energy Services, Inc.
Texas, United States
Patent: 2
With the analysis among related 66 patents in last 5 years, we discover 38 new entrants. Obara Korea Corp., Tessonics, Inc., University of British Columbia are the most active new entrants in this area.
University of British Columbia
British Columbia, Canada
Patent: 3
Nanjing Umiya Information Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 2
Guangdong OPPO Mobile Telecommunications Corp., Ltd.
Guangdong Sheng, China
Patent: 2
National Hospital Organization
Yeda Research & Development Co. Ltd.
With the analysis among 36 patents, we discovered top 15 universities and scientific research institutions by total patent application. University of British Columbia, Kyoto University, The Hong Kong Polytechnic University are dominant in this area. They take 25.00% of the total patent filing.
University of British Columbia
British Columbia, Canada
Patent: 3
The Hong Kong Polytechnic University
Hong Kong SAR, China
Patent: 2
Liaoning University of Petroleum & Chemical Technology
Liaoning Sheng, China
Patent: 2
New York, United States
Patent: 1
Virginia, United States
Patent: 1
Jilin Sheng, China
Patent: 1
Taiwan Province, China
Patent: 1
Chiba-ken, Japan
Patent: 1
Nagoya Institute of Technology
Aichi-ken, Japan
Patent: 1