Search results for “Ultrasonic consolidation” companies
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Key Players
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Innovation Intensity
With the analysis among 59 patents, we discovered top 23 key players by total patent application. Solidica, Inc., The Boeing Co., Airbus Operations Ltd. are dominant in this area. They take 50.85% of the total patent filing.
Solidica, Inc.
California, United States
Patent: 12
The Boeing Co.
Virginia, United States
Patent: 9
Airbus Operations Ltd.
BRISTOL, United Kingdom
Patent: 9
UT-Battelle LLC
Tennessee, United States
Patent: 3
General Electric Co.
Massachusetts, United States
Patent: 2
United Technologies Corp.
Connecticut, United States
Patent: 2
Northrop Grumman Systems Corp.
Virginia, United States
Patent: 2
STARTUP
Agile Ultrasonics Corp.
Ohio, United States
Patent: 2
TE Connectivity Solutions GmbH
Switzerland
Patent: 2
Raytheon Co.
Shanghai Shi, China
Patent: 2
Startups & Unicorns
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Innovation Intensity
With the analysis among 2 patents, we discovered top 1 start-ups by total patent application.
STARTUP
Agile Ultrasonics Corp.
Ohio, United States
Patent: 2
Fast-Growing
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Innovation in recent 5 years
With the analysis among related 18 patents applied in the last 5 years. We discover 17 most active companies in this area. The fast-growing Harbin Engineering University, TE Connectivity Solutions GmbH, Agile Ultrasonics Corp. take 33.33% of patent filing during this period.
Harbin Engineering University
Heilongjiang Sheng, China
Patent: 2
TE Connectivity Solutions GmbH
Switzerland
Patent: 2
STARTUP
Agile Ultrasonics Corp.
Ohio, United States
Patent: 2
TE Connectivity Germany GmbH
Berlin, Germany
Patent: 2
Northrop Grumman Systems Corp.
Virginia, United States
Patent: 2
Naval Research Laboratory
District of Columbia, United States
Patent: 1
Commercial Aircraft Corp. of China Ltd.
Shanghai Shi, China
Patent: 1
Zhejiang Ocean University
Zhejiang Sheng, China
Patent: 1
Qingdao Harbin Material Forming Research Institute Co., Ltd.
Shandong Sheng, China
Patent: 1
Nanjing Youtian Metal Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 1
New Entrants
Order by:
Innovation in recent 5 years
With the analysis among related 18 patents in last 5 years, we discover 15 new entrants. TE Connectivity Solutions GmbH, Agile Ultrasonics Corp., TE Connectivity Germany GmbH are the most active new entrants in this area.
TE Connectivity Solutions GmbH
Switzerland
Patent: 2
STARTUP
Agile Ultrasonics Corp.
Ohio, United States
Patent: 2
TE Connectivity Germany GmbH
Berlin, Germany
Patent: 2
Northrop Grumman Systems Corp.
Virginia, United States
Patent: 2
Naval Research Laboratory
District of Columbia, United States
Patent: 1
Commercial Aircraft Corp. of China Ltd.
Shanghai Shi, China
Patent: 1
Zhejiang Ocean University
Zhejiang Sheng, China
Patent: 1
Qingdao Harbin Material Forming Research Institute Co., Ltd.
Shandong Sheng, China
Patent: 1
Nanjing Youtian Metal Technology Co., Ltd.
Jiangsu Sheng, China
Patent: 1
Jilin University
Jilin Sheng, China
Patent: 1
Research Institutions
Order by:
Innovation Intensity
With the analysis among 23 patents, we discovered top 9 universities and scientific research institutions by total patent application. Harbin Engineering University, North University of China, Utah State University are dominant in this area. They take 43.48% of the total patent filing.
Harbin Engineering University
Heilongjiang Sheng, China
Patent: 4
North University of China
Shanxi Sheng, China
Patent: 4
Utah State University
Utah, United States
Patent: 2
Jilin University
Jilin Sheng, China
Patent: 1
Nanchang University
Jiangxi Sheng, China
Patent: 1
Chongqing Medical University
Chongqing Shi, China
Patent: 1
Nanjing University of Aeronautics & Astronautics
Jiangsu Sheng, China
Patent: 1
University of Science & Technology Beijing
Beijing Shi, China
Patent: 1
Zhejiang Ocean University
Zhejiang Sheng, China
Patent: 1
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