Search results for “Ultrasonic wire bonding” companies
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Key Players
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Innovation Intensity
With the analysis among 196 patents, we discovered top 67 key players by total patent application. Hitachi Ltd., Hesse & Knipps GmbH, Shinkawa KK are dominant in this area. They take 25.51% of the total patent filing.
Tokyo-to, Japan
Patent: 23
Nordrhein-Westfalen, Germany
Patent: 15
Japan
Patent: 12
Tokyo-to, Japan
Patent: 9
Tokyo-to, Japan
Patent: 8
Japan
Patent: 8
Osaka-fu, Japan
Patent: 7
Baden-Württemberg, Germany
Patent: 6
Japan
Patent: 5
Singapore
Patent: 5
Startups & Unicorns
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Innovation Intensity
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Fast-Growing
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Innovation in recent 5 years
With the analysis among related 6 patents applied in the last 5 years. We discover 5 most active companies in this area. The fast-growing Olympus Corp., State Grid Fujian Electric Power Co., Shenzhen Xinyichang Kaijiu Automation Equipment Co., Ltd take 66.67% of patent filing during this period.
Tokyo-to, Japan
Patent: 2
Fujian Sheng, China
Patent: 1
Guangdong Sheng, China
Patent: 1
Beijing Shi, China
Patent: 1
Oita Device Technology Co., Ltd.
Oita-ken, Japan
Patent: 1
New Entrants
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Innovation in recent 5 years
With the analysis among related 6 patents in last 5 years, we discover 5 new entrants. Olympus Corp., State Grid Fujian Electric Power Co., Shenzhen Xinyichang Kaijiu Automation Equipment Co., Ltd are the most active new entrants in this area.
Tokyo-to, Japan
Patent: 2
Fujian Sheng, China
Patent: 1
Guangdong Sheng, China
Patent: 1
Beijing Shi, China
Patent: 1
Oita Device Technology Co., Ltd.
Oita-ken, Japan
Patent: 1
Research Institutions
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Innovation Intensity
With the analysis among 9 patents, we discovered top 6 universities and scientific research institutions by total patent application. Waseda University, Xi'an Jiaotong University, Tiangong University are dominant in this area. They take 33.33% of the total patent filing.
Tokyo-to, Japan
Patent: 1
Shaanxi Sheng, China
Patent: 1
Tianjin Shi, China
Patent: 1
Shaanxi Sheng, China
Patent: 1
Zhejiang Sheng, China
Patent: 1
Jiangsu Sheng, China
Patent: 1
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