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Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.
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Rosemount, Inc.Dr. Johannes Heidenhain GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Samsung Medison Co., Ltd.Hitachi Aloka Medical Ltd.Key Safety Systems, Inc.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.ELAN Microelectronics Corp.InvenSense, Inc.ifm electronic GmbHPreh GmbHCrucialtec Co., Ltd.Pepperl+Fuchs, Inc.Egis Technology, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.FlexEnable Ltd.FIGARO Engineering, Inc.Sensirion AGSchülke & Mayr GmbHNippon Ceramic Co., Ltd.FUJIFILM SonoSite, Inc.Therm-O-Disc, Inc.Fingerprint Cards ABMeasurement Specialties, Inc.
