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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
LAPIS Semiconductor Co. Ltd.Asahi Kasei Microdevices Corp.MegaChips Corp.InvenSense, Inc.Hottinger Baldwin Messtechnik GmbHKionix, Inc.Hillcrest Laboratories, Inc.QuickLogic Corp.MEMSIC, Inc.AEye Technologies, Inc.Autobrains Technologies Ltd.Innoviz TechnologiesTRX Systems, Inc.Innovusion, Inc.Damon Motors, Inc.Standing Egg, Inc.Konux GmbHThales Visionix, Inc.Oculii Corp.InpixonSolfice Research, Inc.Vayavision Sensing Ltd.Ineda Systems, Inc.DynoSense Corp.Yost Engineering, Inc.ISWD Corp.Phantom AI, Inc.SenionLab ABindoo.rs GmbHCloudNav, Inc.
Toyota Motor Corp.Hyundai Motor Co., Ltd.Kia Corp.PhilipsXerox Holdings Corp.The Boeing Co.Thales GroupSubaru Corp.Subaru Corp.Phillips Petroleum Co.Phillips Petroleum Co.Hitachi Astemo Ltd.Otis Elevator Co.Hino Motors, Ltd.telent Ltd.JATCO Ltd.Firestone Tire & Rubber Co.Giesecke+Devrient GmbHThe Nippon Signal Co., Ltd.Akebono Brake Industry Co., Ltd.Bombardier Transportation GmbHConoco, Inc.Conoco, Inc.Waymo LLCYutong Bus Co., Ltd.Yutong Bus Co., Ltd.Volvo ABNippon Sharyo, Ltd.Showa Corp.SAMSUNG SDS CO., LTD.
LIG Nex1 Co., Ltd.Raytheon Co.Nokia Siemens Networks OyTokin Corp. /JP/National University of Defense TechnologyNational University of Defense TechnologyAsahi Kasei Microdevices Corp.Guangdong Galanz Enterprises Co., Ltd.New Japan Radio Co., Ltd.Nisshinbo Micro Devices, Inc.Leica Geosystems AGL3Harris Technologies ASA Ltd.Roke Manor Research Ltd.Israel Aerospace Industries Ltd.Keysight Technologies, Inc.MCI, Inc.MCI, Inc.USG Interiors LLCAselsan Elektronik Sanayi ve Ticaret ASMACOM Technology Solutions Holdings, Inc.Vaisala OyjSun Create Electronics Co., Ltd.WM Motor Technology Co., Ltd.Rheinmetall Air Defence AGShanghai Hesai Technology Co., LtdGuangzhou Haige Communications Group Inc. Co.Guangzhou Haige Communications Group Inc. Co.China North Industries Corp.TeleNav, Inc.Shenzhen Silver Basis Technology Co., Ltd.
Hewlett Packard Enterprise Development LPNational University of Defense TechnologyNational University of Defense TechnologyGoerTek Inc.Dongguan University of TechnologyShanghai Maritime UniversityXiamen University of TechnologyHebei University of Science & TechnologyNachi-Fujikoshi Corp.UBTECH Robotics Corp. Ltd.Zhejiang Gongshang UniversityCarnegie Mellon UniversitySoftBank Corp.Iflytek Co., Ltd.iRobot Corp.Lovely Professional UniversityKyushu Institute of TechnologyChandigarh UniversityNanchang Institute of TechnologyNational Kaohsiung University of Applied SciencesBeijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.Osaka Prefecture UniversityFujifilm Dimatix, Inc.City University of Hong KongCity University of Hong KongAmyris, Inc.National Yunlin University of Science & TechnologyVysoká kola Bánská-Technická Univerzita OstravaCompugen Ltd.