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Honeywell International, Inc.Mitsubishi Motors Corp.FANUC Corp.Toyota Industries Corp.Yokogawa Electric Corp.YASKAWA Electric Corp.Magic Leap, Inc.SRI InternationalPixArt Imaging, Inc.Nachi-Fujikoshi Corp.KEYENCE Corp.Denso Wave, Inc.Jungheinrich AGBaker Perkins Ltd.Nippon Avionics Co., Ltd.Reliance Electric Ltd.Dassault Systèmes SAM-System Co., Ltd.ifm electronic GmbHCognex Corp.Hypertherm Associates, Inc.Auris Health, Inc.The Raymond Corp.TECO Electric & Machinery Co., Ltd.Kehua Data Co., Ltd.Kollmorgen Corp.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.Beckhoff Automation GmbH & Co. KG
General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.Raychem Corp.
Shanghai Second Polytechnic UniversityEcole nationale d'ingénieurs de Saint-EtienneInstitute of Strength Physics & Materials Science SB RASESR Technology Ltd.Nippon Institute of TechnologyKonzelmann GmbhTribosonics Ltd.PCS Instruments Ltd.University of MonterreyTriboron International ABEcole Nationale d'Ingénieurs de TARBESSchunk Carbon TechnologyNanovea, Inc.Ecole Centrale LyonFachhochschule Lübeck