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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
ChangXin Memory Technologies, Inc.Shanghai Huali Microelectronics Corp.Fujian Jinhua Integrated Circuit Co., Ltd.SiEn (Qingdao) Integrated Circuits Co., Ltd.Micro Sensor Co. Ltd.Beijing YanDong Microelectronic Co., Ltd.Seeker Wireless Pty Ltd.Catcher Technology Co., Ltd.TPK Holding Co., Ltd.J Sainsbury PlcIberdrola SAMobile Mini, Inc.SpatialBuzz Ltd.Hitron Systems, Inc.Tsinghua Unigroup Co., Ltd.Precision Drilling Corp.XZERES Corp.AOS Technologies, Inc.Washington Gas Light Co.
Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Alcatel-Lucent S AYamaha Corp.Fujikura Ltd.Advantest Corp.Motorola Solutions, Inc.Wistron Corp.Sony Ericsson Mobile Communications ABChina United Network Communications Ltd.Motorola Mobility LLCCommScope Technologies LLCBroadcom Corp.Advanced Semiconductor Engineering, Inc.Rohde & Schwarz GmbH & Co. KGAvaya, Inc.Nexans SAFiberhome Telecommunication Technologies Co., Ltd.Futurewei Technologies, Inc.Compal Electronics, Inc.Oiles Corp.Pegatron Corp.Tamura Electric Works., Ltd.MERCURY Corp.Amalgamated Wireless Australasia Ltd.Shenzhen Coship Electronics Co., Ltd.Yeonwoo Co., Ltd.Viavi Solutions, Inc.Fujian Star-Net Communication Co., Ltd.
Fraunhofer-Gesellschaft eVFujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.SNECMA SAHamamatsu Photonics KKChina University of Petroleum (East China)China University of Petroleum (East China)OSRAM Opto Semiconductors GmbHHIROSE ELECTRIC CO., LTD.Tamura Corp.Lawrence Livermore National LaboratoryPolitechnika WroclawskaCiena Corp.De la Rue International Ltd.MKS Instruments, Inc.Tatsuta Electric Wire & Cable Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.iconectiv LLCHisense Broadband Multimedia Technologies Co., Ltd.Seikoh Giken Co., Ltd.Hisense Broadband Multimedia Technologies Co., Ltd.Toshiba Materials Co., Ltd.NTT Electronics Corp.Finisar Corp.Finisar Corp.MPI Corp.Lumentum Operations LLCIPG Photonics Corp.Mellanox Technologies Ltd.
Electronics & Telecommunications Research InstituteASML Netherlands BVHyundai MicroElectronics Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesNovatek Microelectronics Corp.Beijing NAURA Microelectronics Equipment Co., Ltd.JOLED, Inc.Shanghai Huali Microelectronics Corp.Shanghai Huali Microelectronics Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Wuhan Tian Ma Microelectronics Co., Ltd.Shanghai Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Heraeus Precious Metals GmbH & Co. KGElectro Scientific Industries, Inc.Sanechips Technology Co., Ltd.Nuvoton Technology Corp.MPI Corp.LX Semicon Co., Ltd.Fujitsu Microelectronics, Inc.ELAN Microelectronics Corp.InvenSense, Inc.Kateeva, Inc.Raydium Semiconductor Corp.Aselsan Elektronik Sanayi ve Ticaret ASShanghai AVIC Optoelectronics Co., Ltd.CMC Materials, Inc.Hangzhou Silan Microelectronics Co., Ltd.