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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Quellan, Inc.Newlans, Inc.Kongsberg Norspace ASS2 Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Teledyne Signal Processing Devices Sweden ABCRFS Ltd.Applied Signals Intelligence, Inc.Mercury Defense Systems, Inc.L-3 Services, Inc.
LIG Nex1 Co., Ltd.Raytheon Co.Nokia Siemens Networks OyTokin Corp. /JP/National University of Defense TechnologyNational University of Defense TechnologyAsahi Kasei Microdevices Corp.Guangdong Galanz Enterprises Co., Ltd.New Japan Radio Co., Ltd.Nisshinbo Micro Devices, Inc.Leica Geosystems AGLeica Geosystems AGL3Harris Technologies ASA Ltd.Roke Manor Research Ltd.Israel Aerospace Industries Ltd.Keysight Technologies, Inc.MCI, Inc.MCI, Inc.USG Interiors LLCAselsan Elektronik Sanayi ve Ticaret ASMACOM Technology Solutions Holdings, Inc.Vaisala OyjSun Create Electronics Co., Ltd.Rheinmetall Air Defence AGShanghai Hesai Technology Co., LtdGuangzhou Haige Communications Group Inc. Co.Guangzhou Haige Communications Group Inc. Co.Toshiba Hokuto Electronics Corp.TeleNav, Inc.Shenzhen Silver Basis Technology Co., Ltd.
Canon, Inc.Canon, Inc.Hitachi Ltd.Koninklijke Philips NVKoninklijke Philips NVGeneral Electric Co.General Electric Co.FUJIFILM Corp.Konica Minolta, Inc.Bayer HealthCare Pharmaceuticals, Inc.Hamamatsu Photonics KKWisconsin Alumni Research FoundationHitachi Medical Corp.Hitachi Medical Corp.Canon Medical Systems Corp.Analog Devices, Inc.University of MinnesotaShenzhen Mindray Bio-Medical Electronics Co., Ltd.Shanghai United Imaging Healthcare Co., Ltd.TEAC Corp.New York UniversitySiemens Medical Solutions USA, Inc.Agfa-Gevaert NVShanghai United Imaging Healthcare Co., Ltd.Siemens Healthcare Diagnostics, Inc.Fujikin, Inc.Kodak Pathe SASUniversity of MelbourneJFE Engineering Corp.Samsung Medison Co., Ltd.