ShopifyRedditTik tokAppleSquarespaceSoundcloudMediumParallelsZoomGoogleGodaddyMicrosoftForbesEtsyHuawei TechnologiesYandexAmazonEvent briteDribbbleHatenaWalmartWPengineUberSplunkServiceNowTwilioHubSpotMuleSoftBloombergCargill
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.ZTE Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.Toshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Otis Elevator Co.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Hewlett Packard Enterprise Development LPNational University of Defense TechnologyNational University of Defense TechnologyGoerTek Inc.Dongguan University of TechnologyShanghai Maritime UniversityXiamen University of TechnologyHebei University of Science & TechnologyNachi-Fujikoshi Corp.UBTECH Robotics Corp. Ltd.Zhejiang Gongshang UniversityCarnegie Mellon UniversitySoftBank Corp.Iflytek Co., Ltd.iRobot Corp.Lovely Professional UniversityKyushu Institute of TechnologyChandigarh UniversityNanchang Institute of TechnologyNational Kaohsiung University of Applied SciencesBeijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.Osaka Prefecture UniversityFujifilm Dimatix, Inc.City University of Hong KongCity University of Hong KongAmyris, Inc.National Yunlin University of Science & TechnologyVysoká kola Bánská-Technická Univerzita OstravaCompugen Ltd.
Daimler-Benz Aerospace AGFried. Krupp GmbHGebrueder SulzerNippon Steel Nisshin Co., Ltd.LIXIL Corp. /Old/Koenig & Bauer AGKoenig & Bauer AGTaiheiyo Cement Corp.Kennametal, Inc.China Construction Eighth Engineering Division Corp. Ltd.China Construction Second Engineering Bureau Co., Ltd.United States Gypsum Co.China Railway Siyuan Survey & Design Group Co., Ltd.United States Gypsum Co.Combustion Engineering, Inc.Primetals Asset Management U.K. Ltd.Saint-Gobain TM KKZhejiang Yasha Decoration Co., Ltd.Albemarle Corp.Paul Wurth SAJohns Manville Corp.Powerchina Huadong Engineering Corp. Ltd.Powerchina Huadong Engineering Corp. Ltd.Shanghai Baoye Group Co., Ltd.Graco, Inc.China Construction Seventh Engineering Division Corp. Ltd.SMS group GmbHKorea Institute of Construction TechnologyThe First Co. of China Eighth Engineering Bureau Ltd.RHI Magnesita Deutschland AG
Samsung Electronics Co., Ltd.International Business Machines Corp.Huawei Technologies Co., Ltd.Intel Corp.Apple, Inc.Google LLCNTT DOCOMO, Inc.South China University of TechnologyMicrosoft Corp.Industrial Technology Research InstituteShanghai Jiao Tong UniversityZhejiang University of TechnologyHarbin Institute of TechnologyInventec Corp.University of Electronic Science & Technology of ChinaBeihang UniversityKunming University of Science & TechnologyMediaTek, Inc.Dalian University of TechnologyAdvanced Micro Devices, Inc.Wuhan UniversityTongji UniversityBeijing Institute of TechnologyMinolta Co., Ltd.Meta Platforms, Inc.Zhejiang Sci-Tech UniversitySouthwest Jiaotong UniversityFuzhou UniversityHarbin University of Science & TechnologySK Telecom Co., Ltd.
