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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLCMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SCitrix Systems, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Sandvik AktiebolagOlivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.
NVIDIA Corp.Silicon Graphics, Inc.NVIDIA Technology UK Ltd.Guangdong Virtual Reality Technology Co. Ltd.Guangdong Virtual Reality Technology Co. Ltd.Marvell Semiconductor, Inc.
LAPIS Semiconductor Co. Ltd.Asahi Kasei Microdevices Corp.MegaChips Corp.InvenSense, Inc.Hottinger Baldwin Messtechnik GmbHKionix, Inc.Hillcrest Laboratories, Inc.QuickLogic Corp.MEMSIC, Inc.AEye Technologies, Inc.Autobrains Technologies Ltd.Innoviz TechnologiesTRX Systems, Inc.Innovusion, Inc.Damon Motors, Inc.Standing Egg, Inc.Konux GmbHThales Visionix, Inc.Oculii Corp.InpixonSolfice Research, Inc.Ineda Systems, Inc.DynoSense Corp.Yost Engineering, Inc.Phantom AI, Inc.ISWD Corp.SenionLab ABindoo.rs GmbHTraxen, Inc.CloudNav, Inc.
Samsung Electronics Co., Ltd.International Business Machines Corp.Huawei Technologies Co., Ltd.Intel Corp.Apple, Inc.Google LLCNTT DOCOMO, Inc.South China University of TechnologyMicrosoft Corp.Industrial Technology Research InstituteShanghai Jiao Tong UniversityZhejiang University of TechnologyHarbin Institute of TechnologyInventec Corp.University of Electronic Science & Technology of ChinaBeihang UniversityKunming University of Science & TechnologyMediaTek, Inc.Dalian University of TechnologyAdvanced Micro Devices, Inc.Wuhan UniversityTongji UniversityBeijing Institute of TechnologyMinolta Co., Ltd.Zhejiang Sci-Tech UniversitySouthwest Jiaotong UniversityFuzhou UniversityHarbin University of Science & TechnologySK Telecom Co., Ltd.Wisconsin Alumni Research Foundation