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Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.YASKAWA Electric Corp.SZ DJI Technology Co., Ltd.JD.com, Inc.Miele & Cie. KGMattel, Inc.LEGO A/SLEGO A/SBando Chemical Industries Ltd.National Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologyShenyang Institute of AutomationShibuya Corp.Nitto Kohki Co., Ltd.Tatsuno Corp.Nachi-Fujikoshi Corp.Bozhon Precision Industry Technology Co., Ltd.Bozhon Precision Industry Technology Co., Ltd.KEYENCE Corp.Denso Wave, Inc.Teradyne, Inc.Guangzhou Jifei Electronics Technology Co., Ltd.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.Yamaha Motor Co., Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABHaldor Topse A/SLEGO A/SQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.Bozhon Precision Industry Technology Co., Ltd.Bozhon Precision Industry Technology Co., Ltd.
Honda Motor Co., Ltd.FANUC Corp.Shibaura Machine Co., Ltd.LEGO A/SLEGO A/SNachi-Fujikoshi Corp.Denso Wave, Inc.Teradyne, Inc.UBTECH Robotics Corp. Ltd.SoftBank Corp.iRobot Corp.Ecovacs Robotics Co., Ltd.SIASUN Robot & Automation CO., Ltd.SIASUN Robot & Automation CO., Ltd.Hasbro, Inc.Oshkosh Corp.Kollmorgen Corp.Parrot SAGrenzebach Maschinenbau GmbHJ. Schmalz GmbHSCHUNK GmbH & Co. KGShibuya Seiki Co., Ltd.Noblelift Intelligent Equipment Co., Ltd.ATS Corp.DESTACO Europe GmbHKongsberg Maritime ASMachinery Technology Development Co., Ltd.Machinery Technology Development Co. Ltd.Locus Robotics Corp.The Catholic University of America
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.
