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Intel Corp.3M Innovative Properties Co.Taiwan Semiconductor Manufacturing Co., Ltd.Bayerische Motoren Werke AGJanssen Pharmaceutica NVAdvantest Corp.NIKE, Inc.Chongqing Changan Automobile Co. Ltd.Milliken & Co. (South Carolina)Raychem Corp.Lear Corp.International Paper Co.Nanya Technology Corp.Varian Semiconductor Equipment Associates, Inc.Delta Faucet Co.Atlas Copco ABBrembo SpAPACCAR, Inc.Shanghai Zhenhua Heavy Industries Co., Ltd.Power Integrations, Inc.Wistron NeWeb Corp.Samsung C&T Corp.Hitachi-LG Data Storage, Inc.Xiamen Solex High-Tech Industries Co. Ltd.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.HMD Global OyAutodesk, Inc.FARO Technologies, Inc.JUUL Labs, Inc.
Ricoh Co., Ltd.Ricoh Co., Ltd.Hewlett-Packard Development Co.Eastman Kodak Co.Dai Nippon Printing Co., Ltd.Konica Minolta, Inc.Koninklijke DSM NVMassachusetts Institute of TechnologyNGK SPARK PLUG CO., LTD.Saudi Arabian Oil Co.Mitsubishi Paper Mills Ltd.Kennametal, Inc.Unisys Corp.Tokyo Seimitsu Co., Ltd.Waymo LLCRenishaw PlcLenzing AGSMS group GmbHSandvik AktiebolagManroland Sheetfed GmbHMimaki Engineering Co., Ltd.Hoeganaes Corp.Align Technology, Inc.Draper, Inc.IDEC Corp.Greatbatch Ltd.Widex A/SWidex A/S3D Systems, Inc.Autodesk, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
FANUC Corp.The Black & Decker Corp.DISCO Corp.Koki Holdings Co. Ltd.Makita Corp.Kennametal, Inc.Ishihara Sangyo KKISCAR Ltd.Daihen Corp.Okuma Corp.Han's Laser Technology Industry Group Co., Ltd.Han's Laser Technology Industry Group Co., Ltd.THK CO., LTD.Sumitomo Electric Hardmetal Ltd.Hangzhou Great Star Industrial Co., Ltd.Hangzhou Great Star Industrial Co., Ltd.Towa Corp.TRUMPF Werkzeugmaschinen GmbH + Co. KGMorgan Construction Co.Mitsui High-tec, Inc.Bobst SAMilacron LLCIndustrial Products, Inc.Yamazaki Mazak Corp.Tanaka Kogyo KKToyo Machinery & Metal Co., Ltd.Allied Material Corp.Hitachi Powdered Metals Co., Ltd.OSG Corp. (6136)Komatsu Forklift Co. Ltd.
Flavor Burst Co. LLPReinhardt GmbHJ&J Snack Foods Corp.Ernst Reinhardt GmbH
Shinva Medical Instrument Co., Ltd.Meiko Maschinenbau GmbH & Co. KGW&H Dentalwerk Bürmoos GmbHAlenia Aermacchi SpAEschmann Holdings Ltd.TSO3, Inc.Jiangsu Shennong Autoclave, Inc.Tex Year Industries, Inc.Ningbo Runyes Medical Instrument Co. Ltd.Maschinenbau Scholz GmbH & Co. KGLamiflex SpAFedegari Autoclavi SpASINOARP Tires Equipment Technology (Suzhou) Co. Ltd.Belimed AGPanini SrlHirayama Manufacturing Corp.KANGWON ENERGY Co., Ltd.Medin Ltd.Jiangyin Binjiang Medical Equipment Co., Ltd.Jiangyin Binjiang Medical Equipment Co., Ltd.Hanshin Medical Co., Ltd.Steriflow SASMelag OhgFMW Composite Systems, Inc.The Leeds & Bradford Boiler Co. Ltd.LagardeTesalys SASJosef Jasper GmbH & Co. KGJL Goslar GmbHItalmatic SRL
General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.Raychem Corp.