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Tencent Technology (Shenzhen) Co., Ltd.Oracle America, Inc.Hewlett Packard Enterprise Development LPHeidelberger Druckmaschinen AGKronos Co. Ltd.China Telecom Corp. Ltd.Dolby International ABUnisys Corp.Tata Consultancy Services Ltd.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Synopsys, Inc.SAMSUNG SDS CO., LTD.The Nielsen Company (US) LLCWINCOR NIXDORF International GmbHCanon IT Solutions, Inc.NTT DATA Corp.Giesecke+Devrient Mobile Security GmbHToshiba Solutions Corp.Vtron Group Co., Ltd.3D Systems, Inc.Zhejiang Geely Commercial Vehicles Group Co. Ltd.NTT Communications Corp.Visa U.S.A., Inc.Veritas Technologies LLCCOLOPL, Inc.Uchida Yoko Co., Ltd.NEC Personal Computers Ltd.Alto SARLBeijing Topsec Network Security Technology Co. Ltd.
International Business Machines Corp.Fujitsu Ltd.Tencent Technology (Shenzhen) Co., Ltd.Yokogawa Electric Corp.Hewlett Packard Enterprise Development LPSeagate Technology LLCDelphi Technology, Inc.Praxair S.T. Technology, Inc.Dolby International ABLife Technologies Corp.Unisys Corp.Tata Consultancy Services Ltd.VMware, Inc.Inspur Electronic Information Industry Co., Ltd.Avaya, Inc.MiTAC International Corp.SnapTrack, Inc.Siemens Medical Solutions USA, Inc.Heroku, Inc.Agfa-Gevaert NVLandmark Graphics Corp.Fiberhome Telecommunication Technologies Co., Ltd.Shima Seiki Mfg. Ltd.Shima Seiki Mfg. Ltd.NARI Technology Co., Ltd.Rambus, Inc.Canon Marketing Japan, Inc.HRL Laboratories LLCBull SANEC Soft Ltd.
Lucent Technologies, Inc.Xiaomi Corp.Douyin Vision (Beijing) Co., Ltd.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Beijing Didi Infinity Technology & Development Co., Ltd.Beijing Didi Infinity Technology & Development Co., Ltd.Alto SARLMacrovision Corp.Grow Solutions Tech LLCElectronic Data Systems Corp.ASK SANEC (China) Co., Ltd.LG N Sys, Inc.Beijing China Power Information Technology Co., LTDShenzhen Youwo Network Technology Co., Ltd.Weikun (Shanghai) Technology Service Co., Ltd.Guangzhou Boguan Telecommunication Technology Co., Ltd.Zhongan Information Technology Services Co., Ltd.Weikun (Shanghai) Technology Service Co., Ltd.Hwatsing Technology Co., Ltd.Guangzhou Boguan Telecommunication Technology Co., Ltd.Tandberg Data ASATOYOTA InfoTechnology Center Co. Ltd.Siemens Medical Solutions Health Services Corp.CSIC Haiwei Zhengzhou High-Tech Co., Ltd.Zhuhai Gaoling Information Technology Co.,LtdChinainstru & Quantumtech (Hefei) Co. Ltd.Hitachi System & Services Ltd.Hitachi System & Services Ltd.
3M Innovative Properties Co.Eastman Kodak Co.Motorola, Inc.Kyoraku Sangyo KKYeda Research & Development Co. Ltd.Worldwide Specialty Property Services Pty Ltd.Worldwide Specialty Property Services Pty Ltd.Mastercard International, Inc.Yissum Research Development Co. Ltd.Purdue Research FoundationPalo Alto Research Center, Inc.Ampex Corp.Disney Enterprises, Inc.IP2IPO Innovations Ltd.Ramot at Tel Aviv University Ltd.Konkuk University Industry-Academic Cooperation FoundationImagination Technologies Ltd.Intellectual Discovery Co., Ltd.Energy Conversion Devices, Inc.Appotronics Corp. Ltd.Mosaid Technologies, Inc.UCL Business Ltd.International Engine Intellectual Property Co. LLCInternational Truck Intellectual Property Co. LLCDigimarc Corp.Ansaldo Energia IP UK Ltd.Conversant Wireless Licensing SARLLongitude Licensing Ltd.Tecpharma Licensing AGMasimo Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGChipMOS Technologies, Inc.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Amkor Technology, Inc.NEPES Corp.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Seoul National UniversityTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Tera Probe, Inc.CONNECTEC JAPAN Corp.Palomar Technologies, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Murata Electronics North America, Inc.GE Embedded Electronics Oy
Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Synopsys, Inc.Polaris Innovations Ltd.Qimonda AGChipMOS Technologies, Inc.Powertech Technology, Inc.Xintec, Inc.NEPES Corp.Camtek Ltd.Subtron Technology Co., Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Zuken Ltd.Seoul National UniversityShanghai Meadville Science & Technology Co., Ltd.Trust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Tera Probe, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Silvaco, Inc.Murata Electronics North America, Inc.Integrated System Assemblies Corp.Nexsem, Inc.GE Embedded Electronics OyWest Bond, Inc.